China Ramps Up Semiconductor Production Across Regions

In a significant development for the semiconductor industry, China is rapidly advancing chip production projects across cities such as Nanjing, Beijing, Yangzhou, Guangzhou, Haikou, and Longyan. These projects span a variety of domains, including silicon carbide (SiC), IGBTs, and filter chips, showcasing China’s strategic commitment to boosting its semiconductor capabilities.

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Highlights from Regional Chip Initiatives

Nanjing: 8-Inch SiC Substrates Near Mass Production

Nanjing’s Jiangbei New Area has witnessed significant strides in SiC substrate technology. Ultra芯星 Semiconductor recently relocated to a new facility and is set to commence mass production of 8-inch SiC single-crystal substrates. The company, established in 2019, aims to scale production to 1.5 million 6-8 inch SiC substrates annually, meeting both domestic and international demand.

Yangzhou: Equipment Installed for Second 6-Inch Line

Crystal Microelectronics announced the installation of equipment for its second 6-inch production line, with trial samples expected by February 2025 and mass production starting in May 2025. The company is also investing in advanced 8-inch SiC and 12-inch IGBT chip production facilities, aiming to capitalize on the rising demand for automotive electronics.

Beijing: Automotive-Grade Power Semiconductor Base

RuinoMicro, a subsidiary of Ruino Semiconductor, completed its facility for a new 6-inch automotive-grade power semiconductor wafer production base. Set to launch production by June 2025, the base will produce 120,000 wafers annually, focusing on high-performance semiconductors for EVs and IoT applications.

Longyan: Global First in Ultra-Wide Bandgap Filter Chips

Fujian Jingxu Semiconductor is constructing the world's first production line for ultra-wide bandgap semiconductor high-frequency filter chips. The ¥1.68 billion project will address gaps in China’s 5G RF chip technology, offering innovative solutions for the industry.

Haikou: Advanced SiC Packaging and AMOLED Modules

Huaxinbang Semiconductor is setting up advanced SiC chip packaging and AMOLED module production lines in Haikou. This project will strengthen Hainan’s semiconductor ecosystem and meet growing market demands for energy-efficient automotive systems.

Guangzhou: Filter Chip Annual Capacity to Hit 30 Billion

Everlight Communication is establishing a production base in Guangzhou for its SABAR 5G filter chips, expected to produce 30 billion chips annually. This initiative will enhance China’s market share in 5G communications components.

Jiaxing: 12-Inch Power Chip Line Approved

Jiaxing Starchip Electronics received environmental clearance for an 18,000-piece annual 12-inch power chip production line. Another project focusing on SiC chip production is expected to start operations by March 2024, with a capacity of 360,000 wafers per year.

Implications for China’s Semiconductor Industry

These regional initiatives represent a coordinated push to strengthen China’s position in the global semiconductor market. Key outcomes include:

1. Technological Leadership: Innovations in SiC and ultra-wide bandgap technologies are closing the gap with international competitors.
2. Capacity Expansion: Investments in advanced manufacturing facilities are poised to meet surging demand across industries like EVs, 5G, and IoT.
3. Economic Impact: The projects are expected to drive economic growth, create jobs, and enhance China’s resilience in the global semiconductor supply chain.

As these projects near completion and commence operations, China’s semiconductor industry is well-positioned to achieve significant breakthroughs, securing its place as a global technology leader.