Hua Hai Qing Ke Launches Beijing Facility to Advance Semiconductor Equipment Development

On January 15, Hua Hai Qing Ke officially launched its Beijing facility, marking a significant milestone for the company’s Integrated Circuit High-End Equipment R&D and Industrialization Project. This new facility is managed by Hua Hai Qing Ke (Beijing) Technology Co., Ltd., a wholly-owned subsidiary of the company.

Located in Yizhuang New City, Beijing, the facility spans over 70,000 square meters and is dedicated to the development and industrialization of advanced semiconductor equipment. With its inauguration, Hua Hai Qing Ke aims to accelerate innovation in wet etching, wafer thinning, and chemical mechanical polishing (CMP) technologies. The facility will also enhance the company's production capacity and strengthen its research and development capabilities.

Company Overview

Hua Hai Qing Ke is a leading high-end semiconductor equipment manufacturer with core independent intellectual property rights. The company offers a broad range of products and services, including:

CMP equipment for polishing semiconductor wafers.

Thinning equipment to enable the production of ultra-thin wafers.

Dicing equipment for wafer cutting.

Wet process equipment for cleaning and etching.

Wafer regeneration services to recycle used wafers.

Consumables and maintenance services to support semiconductor manufacturers.

By integrating advanced equipment manufacturing with support services, Hua Hai Qing Ke provides comprehensive solutions for the semiconductor industry.

The launch of the Beijing facility signals Hua Hai Qing Ke’s commitment to advancing domestic semiconductor capabilities and driving innovation in China’s semiconductor equipment sector.