Processor Core - Dual-core ARM Cortex A55@850MHz - 32KB I-Cache, 32KB D-Cache, 256KB L3 cache - Support NEON acceleration, integrated FPU processing unit - TrustZone support |
System Level Acceleration Module - Integrated hardened standard CRC32/CRC16/CRC8 polynomial arithmetic unit - Integrated hardened high-speed Direct Data Migration Module (DMA) |
Intelligent Video Analytics - Neural Networks Supports complete API and toolchain for easy customer development. - Upgraded IVE algorithm to support feature point detection, perimeter, optical flow and various computer morphology algorithms. - Upgraded DPU algorithm to realize binocular depth map acceleration unit with maximum resolution of 2048x2048, maximum parallax of 224, and processing performance of 720p@30fps. |
Video Codec - Support H.264 BP/MP/HP Level 5.1 - Support H.265 Main Profile Level 5.1 - H.264/H.265 codec with maximum resolution of 6144x6144 - Support I/P Frame - Typical performance of H.264/H.265 multi-stream codec is as follows: -2592x1944@30fps (encoded) +1920x1080@30fps (encoded) +720x480@30fps (encoded) -3072x1728@30fps(encoded)+1920x1080@30fps(encoded)+720x480@15fps(encoded) -3200x1800@20fps(encoded)+1920x1080@30fps(encoded)+720x480@30fps(encoded) -2592x1944@30fps(encode)+720x480@30fps(encode)+1920x1080@30fps(decode) -2592x1944@30fps(Decode) - Support 8 regions of pre-encoding OSD overlay - Support CBR/VBR/AVBR/FIXQP/QPMAP and other bit rate control modes. - Maximum output bit rate 80Mbps - Support 8 regions of interest (ROI) encoding. - Support video front-end overlay mosaic encoding - Supports digital watermarking - Support PVC perceptual coding to reduce the code stream - Supports JPEG Baseline codec - JPEG Codec Maximum Resolution 16384x16384 - JPEG Maximum Performance -Encoding: 2592x1944@60fps(YUV420) -Decoding: 2592x1944@30fps(YUV420) |
ISP - Support multi-channel sensor processing at the same time - Support 3A (AE/AWB/AF) function, 3A parameters can be adjusted by users. - Supports Fixed Pattern Noise Removal (FPN) - Supports bad dot correction and lens shadow correction. - Supports two-frame WDR and Advanced Local Tone Mapping, strong light suppression and backlight compensation. - Supports multi-level 3D denoising - Supports image edge enhancement - Supports defogging - Dynamic Contrast Enhancement - Support 3D-LUT color adjustment - Support new generation lens distortion correction - Support fisheye and other arbitrary shape geometry correction - Support 6-DoF digital stabilization - Supports gyroscope stabilization and Rolling-Shutter correction. - Supports image Mirror, Flip, 90 degree/270 degree rotation. - Supports real-time DRC, BNR, 3DNR or DM processing of images using neural networks. - Supports dual-optical fusion of black-and-white and color images. - Provides PC-side ISP adjustment tools |
Video and Graphics Processing - Supports 1/15.5~16x scaling of graphics and images. - Support horizontal panoramic stitching Input 2 channels 1920x1080@30fps, maximum output 3840x1080@30fps or 1920x2160@30fps - Support video layer and graphic layer overlay - Support color space conversion |
Video Input Interface - Support 4-Lane image sensor serial input, support MIPI/LVDS/Sub-LVDS/HiSPi interfaces. - Supports 4-Lane or 2x2-Lane and other combinations, supports up to 2 sensor inputs. - Support 8/10/12/14 Bit RGB Bayer DC timing video input, clock frequency up to 148.5MHz. - Support BT.601, BT.656, BT.1120 video input interface - Supports 1~4 YUV through MIPI virtual channel inputs - Support mainstream CMOS level thermal imaging sensor access - Support structured light image module - Support cw ToF image sensor |
Video Output Interface - Support one way BT.1120 or BT.656 interface output, of which BT.1120 maximum performance 1920x1080@60fps - Support 6/8bit serial or 16/18/24bit RGB parallel output, the highest frequency 74.25MHz - Support 4-Lane Mipi DSI/CSI interface output, up to 1.8Gbps/lane, with 1920x1080@60fps performance. - Supports Gamma correction and horizontal sharpen. |
Audio interface and processing - Built-in Audio codec, supports 16bit dual differential voice input and dual single-ended voice output. - Support 1 channel I2S interface, compatible with multi-channel time division multiplexing transmission mode (TDM) - Support 8-way digital MIC array input - Support multi-protocol voice codec - Supports audio 3A (AEC/ANR/ALC) processing. |
Secure Isolation and Engine - Support for Secure Boot - Supports TrustZone-based REE/TEE hardware isolation solution - Neural network modeling and data protection - Hardware implementation of AES128/256 symmetric encryption algorithm - Hardware implementation of RSA3072/4096 signature verification algorithm - Hardware implementation of ECC256/384/512 Elliptic Curve Algorithm - Hardware implementation of SHA256/384/512, HMAC_SHA256/384/512 algorithms - Hardware implementation of the SM2/3/4 state secret algorithm - Hardware implementation of true random number generator - Provide 28Kbit OTP storage space for customer's use. |
Network Interface - 1 Gigabit Ethernet interface -Supports RGMII and RMII interface modes. -Supports acceleration units such as TSO, UFO, COE, etc. |
Peripheral Interface 2 SDIO3.0 interfaces -SDIO0 supports SDXC card, maximum capacity 2TB. -SDIO1 supports wifi module docking - 1 USB3.0 interface -USB Host/Device switchable. - Supports power-on reset (POR) and external input reset. - Integrated independent power supply RTC - Integration of streamlined power-down control logic to realize chip standby wakeup - Integrated 4-channel LSADC - Integrated RGB small screen dedicated three-wire control interface - Multiple UART, I2C, SPI, PWM, and GPIO interfaces |
External Memory Interface - DDR4/LPDDR4/LPDDR4x Interface -Supports 2x16bit DDR4 -Supports 1x32bit LPDDR4/LPDDR4x -Maximum DDR4 rate of 2400Mbps -LPDDR4/LPDDR4x maximum rate 2400Mbps -Maximum capacity 4GB - SPI Nor/SPI Nand Flash Interface Supports 1, 2, and 4-wire modes -SPI Nor Flash supports 3Byte, 4Byte address mode - eMMC5.1 interface, maximum capacity 2TB - Option to boot from eMMC, SPI Nor/SPI Nand Flash |
SDK • support Linux5.10 SDK |
Chip Physical Specifications Power Consumption -2W typical power consumption (coded 5M30 + 2Tops) - Operating Voltage -Core voltage of 0.9V -IO voltage of 1.8/3.3V -DDR4/LPDDR4/LPDDR4x interface voltages of 1.2/1.1/0.6V respectively - Package Format -RoHS, FCCSP 15mmx15mm package -Pin pitch: 0.65mm |