Shanghai Accelerates Advanced Storage and Computing Technology Development

Shanghai is making significant strides in enhancing its computing infrastructure, focusing on expanding computing power capabilities, scaling intelligent computing deployment, and optimizing communication quality within computing networks.

Shanghai is making significant strides in enhancing its computing infrastructure, focusing on expanding computing power capabilities, scaling intelligent computing deployment, and optimizing communication quality within computing networks.

On November 26, Qu Wei, Deputy Director of the Shanghai Science and Technology Commission (Shanghai STC), emphasized the city’s commitment to driving technological innovation in the computing field. He outlined two key initiatives for the future:

1. Strengthening Innovation and R&D

Shanghai STC aims to bolster innovation by increasing investments in scientific research and development. The focus will be on accelerating breakthroughs and product development in key areas such as:

  • High-end domestic intelligent chips
  • Advanced storage technologies
  • Ultra-large-scale intelligent computing centers
  • Intelligent computing networks

These initiatives aim to create a robust innovation ecosystem, supporting the establishment of advanced research frameworks and fostering technological advancements.

2. Promoting Industrial Clusters

Efforts will be made to develop innovation platforms, including proof-of-concept centers, pilot bases, and key laboratories. A collaborative approach between municipal and district governments will encourage industrial clustering within Shanghai’s Zhangjiang High-Tech Park. These measures will cultivate leading enterprises in the computing sector and drive technological leadership in computing power.

Enhancing Computing Infrastructure

Dai Bin, Deputy Director of the Shanghai Communications Administration, provided additional insights into advancing computing infrastructure development. He proposed three strategies:

1. Strengthen the Foundation

With the rise of AI models like ChatGPT, computing power demands have surged exponentially. Dai suggested upgrading traditional data centers into intelligent computing centers through technological innovation, standardization, and infrastructure transformation. High-efficiency computing hubs and cluster-level intelligent computing centers are crucial for meeting the needs of large-scale, complex AI training tasks.

2. Foster a Domestic Computing Ecosystem

Dai emphasized increasing research and development of domestic chips and encouraging chip companies to open computing frameworks. Accelerating the commercialization of cross-domain heterogeneous computing networks and integrating local applications into an open domestic computing ecosystem will be vital for nurturing a sustainable computing power environment.

3. Optimize Computing Resource Allocation

By leveraging telecom operators and internet exchange centers, Shanghai aims to establish a city-wide high-speed optical computing network. This will connect key computing nodes in the Yangtze River Delta region, integrating regional resources into a unified national computing network. Support for interconnected computing platforms and resource-sharing mechanisms will ensure the optimal allocation of computing resources across regions and industries.

Looking Ahead

Shanghai’s initiatives in computing infrastructure and innovation are set to position the city as a leader in intelligent computing. By driving advancements in domestic technologies and fostering collaboration among key stakeholders, Shanghai is paving the way for a future powered by efficient and scalable computing solutions.

Related Articles

  • Huawei’s Hubble Invests in Two Strategic Tech Firms to Strengthen Robotics and Simulation CapabilitiesNews

    Huawei’s Hubble Invests in Two Strategic Tech Firms to Strengthen Robotics and Simulation Capabilities

    Huawei’s investment arm, Hubble Technology Investment, has made two new strategic moves in May 2025, expanding its presence in cutting-edge technology domains. The company has invested in Qianxun Intelligent, a startup focused on embodied AI and humanoid robotics, and Tongyuan SoftControl, a leader in cyber-physical system simulation software. These investments underscore Huawei’s continued commitment to building a robust technological ecosystem across AI, robotics, and advanced industrial software.

  • Samsung’s Harman Acquires Masimo’s Audio Division for $350 Million to Strengthen Automotive Tech FootprintNews

    Samsung’s Harman Acquires Masimo’s Audio Division for $350 Million to Strengthen Automotive Tech Footprint

    May 9, 2025 — Samsung Electronics’ subsidiary Harman International has announced a strategic acquisition of the audio division of U.S.-based Masimo Corporation for $350 million, further cementing its position in the global automotive and consumer electronics markets. The deal marks a significant move in Samsung's ongoing expansion strategy and has sparked speculation around more tech-focused acquisitions in the near future.

  • TSMC Breaks Ground on Third Arizona Fab, Escalating Advanced Chip Manufacturing in the U.S.News

    TSMC Breaks Ground on Third Arizona Fab, Escalating Advanced Chip Manufacturing in the U.S.

    TSMC Arizona has officially begun construction on its third semiconductor fabrication facility in Phoenix, signaling the company’s deepening commitment to building a comprehensive and cutting-edge chip manufacturing hub in the United States. This third fab will sit adjacent to TSMC’s first two facilities, which are scheduled to begin production in 2025 and 2026 with 4nm and 3nm process technologies, respectively.

  • GlobalWafers to Launch First U.S. 12-Inch Silicon Wafer Fab on May 15News

    GlobalWafers to Launch First U.S. 12-Inch Silicon Wafer Fab on May 15

    May 13, 2025 — GlobalWafers, the world’s third-largest semiconductor wafer supplier, is set to officially open its new state-of-the-art facility in Texas on May 15, marking a historic milestone as the first 12-inch silicon wafer production plant in the United States. The new factory is expected to begin contributing to the company’s revenue in the second half of 2025.

  • NEO Semiconductor Unveils Next-Gen 3D X-DRAM Aiming to Boost DRAM Density by 10xNews

    NEO Semiconductor Unveils Next-Gen 3D X-DRAM Aiming to Boost DRAM Density by 10x

    May 9, 2025 — U.S.-based memory innovator NEO Semiconductor has announced a major leap in dynamic random-access memory (DRAM) architecture with the launch of its new-generation 3D X-DRAM technology, featuring the industry’s first 1T1C and 3T0C 3D DRAM cell designs. This breakthrough is set to redefine memory performance and scalability for high-demand applications in AI, edge computing, and in-memory processing.

  • EU Launches "Chips Act 2.0" to Revitalize Semiconductor Ambitions Amid 2030 Goal DoubtsNews

    EU Launches "Chips Act 2.0" to Revitalize Semiconductor Ambitions Amid 2030 Goal Doubts

    The European Union is preparing a strategic upgrade to its semiconductor policy through the introduction of the “EU Chips Act 2.0”, aiming to address mounting concerns over the bloc's ability to meet its 2030 chip production targets. The original Chips Act, which came into effect in 2023, set the ambitious goal of doubling Europe’s share of global semiconductor production to 20%. However, industry insiders and auditors now warn that this target is unlikely to be reached without major structural changes.