SK Hynix Introduces World's First 12-Layer HBM4 Sample for AI Applications

March 19, 2025 – SK Hynix has officially announced the world’s first 12-layer HBM4 sample, marking a major milestone in AI-driven high-performance memory development. The company has begun early sample shipments to key customers and expects to start mass production in the second half of 2025.

Breaking Through AI Memory Limits

The 12-layer HBM4 sets a new benchmark in AI memory technology, achieving unprecedented bandwidth and capacity. It is the first product to support over 2 terabytes per second (TB/s) of bandwidth, which translates to handling over 400 Full-HD (5GB) movies in just one second.

Compared to HBM3E, the 12-layer HBM4 offers a 60% increase in processing speed. It also boasts a maximum capacity of 36GB, utilizing SK Hynix’s Advanced MR-MUF process, which minimizes chip warpage and significantly improves thermal performance, ensuring maximum stability under high workloads.

Leading the AI Memory Market

Since 2022, SK Hynix has successfully led the AI memory market with the HBM3 series and continued its HBM3E mass production in 2024. By developing and delivering HBM solutions on schedule, the company has maintained its dominance in high-performance AI memory solutions.

Advancing AI Infrastructure

Kim Joo-sun, CMO of SK Hynix AI Infra, emphasized the company’s commitment to pushing the boundaries of AI innovation:

“To meet the evolving demands of our customers, SK Hynix has consistently overcome technical barriers, reinforcing our role as a leader in AI ecosystem innovation. With the industry’s largest-scale HBM production experience, we will continue to drive performance validation and production readiness.”

With the 12-layer HBM4 now in sample validation, mass production is set to begin later this year, further solidifying SK Hynix’s leadership in next-generation AI memory solutions.