Besi Semiconductor Sees Q1 Order Growth with Major Hybrid Bonding Deals for HBM4

April 23, 2025 — Netherlands-based advanced packaging equipment supplier Besi Semiconductor reported a solid increase in first-quarter orders, fueled by rising demand from Asia's wafer foundries and the expanding AI data center market.

Besi confirmed it has secured hybrid bonding orders from two leading memory chipmakers specifically for HBM4 (High Bandwidth Memory 4) applications. Hybrid bonding is a critical technology that allows for direct stacking of chips, enabling faster, more efficient interconnects in advanced 2.5D and 3D packaging designs.

The company also noted follow-up orders from a major Asian logic chip foundry, indicating ongoing momentum in AI-related semiconductor demand.

Q1 Performance Highlights

Order Value: €131.9 million (~$150.1 million), marking an 8.2% increase compared to Q4 2024

Stock Movement: Despite a year-to-date drop of approximately 30%, Besi shares surged 9% following the positive Q1 update

Besi’s hybrid bonding equipment is expected to play a central role in the next wave of advanced packaging, particularly for HBM4 memory stacks used in AI accelerators and high-performance computing platforms. As AI workloads scale up, demand for tightly integrated, high-bandwidth memory solutions is pushing semiconductor manufacturers toward more complex packaging technologies.

Besi’s ongoing success in securing orders from major memory and logic chip customers positions the company as a key enabler in the evolving AI hardware landscape.