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Breakthrough: First Light-Atom Entanglement Chip Successfully DevelopedNews

Breakthrough: First Light-Atom Entanglement Chip Successfully Developed

In a groundbreaking achievement, a collaborative research team from the University of Electronic Science and Technology of China (UESTC) and the Tianfu Jiangxi Laboratory, in partnership with Shandong University, has successfully developed the world's first light-atom entanglement chip based on erbium-doped lithium niobate crystal waveguides. This innovation represents a critical step forward in the development of long-distance, high-bandwidth quantum entanglement interconnection systems.

DENSO and Fuji Electric Announce $1.4 Billion Joint SiC Semiconductor ProjectNews

DENSO and Fuji Electric Announce $1.4 Billion Joint SiC Semiconductor Project

On November 29, 2024, DENSO Corporation and Fuji Electric Co., Ltd. announced a joint investment of approximately ¥211.6 billion (around $1.4 billion) to enhance Japan's silicon carbide (SiC) power semiconductor production capacity. This initiative has received approval from Japan's Ministry of Economy, Trade and Industry (METI), which will provide up to ¥70.5 billion in subsidies to support the project.  

Shaoxin and Xinrui Establish Joint Lab for Wafer-Level Bonding Equipment and MaterialsNews

Shaoxin and Xinrui Establish Joint Lab for Wafer-Level Bonding Equipment and Materials

On November 26, 2024, Suzhou Xinrui Technology Co., Ltd. (Xinrui) and Shaoxin Laboratory officially signed a cooperation agreement to establish the "Wafer-Level Bonding Equipment and Materials Joint Laboratory." This milestone partnership marks the start of deep collaboration between the two entities, aiming to drive technological advancements and innovation in the semiconductor industry.