Intel Deploys High-NA EUV, Processes Over 30,000 Wafers
February 27, 2025 – Intel has officially begun using two High-NA EUV lithography machines from ASML to process wafers at its D1 factory near Hillsborough, Oregon. According to Intel senior engineer Steve Carson, the company has already processed over 30,000 wafers using the Twinscan EXE:5000 systems, marking a significant milestone in semiconductor manufacturing.
February 27, 2025 – Intel has officially begun using two High-NA EUV lithography machines from ASML to process wafers at its D1 factory near Hillsborough, Oregon. According to Intel senior engineer Steve Carson, the company has already processed over 30,000 wafers using the Twinscan EXE:5000 systems, marking a significant milestone in semiconductor manufacturing.
High-NA EUV: A Game-Changer for Intel
First Major Chipmaker to Adopt ASML High-NA EUV
Intel is the first semiconductor company to install High-NA EUV machines
Each Twinscan EXE:5000 machine costs €350 million
Intel plans to use these machines for 14A (1.4nm) process node production in the coming years
Key Benefits of High-NA EUV vs. Standard EUV
Higher resolution: Achieves 8nm resolution in a single exposure
Shorter production cycle: Reduces the need for double patterning, improving efficiency and yield
Increased reliability: Intel states the new system is more reliable than previous EUV generations
Intel Gains an Edge in Semiconductor Manufacturing
Early adoption allows Intel to refine critical High-NA EUV technologies like photomasks, protective films, and chemical processes
Intel's feedback to ASML could influence the development of future Twinscan EXE:5200 machines
TSMC and Samsung have taken a more cautious approach, making Intel the first mover in this technology
Why High-NA EUV Matters
Standard EUV (like the Twinscan NXE:3600D/3800E) achieves 13.5nm resolution in a single exposure and requires double patterning to reach 8nm resolution, increasing complexity and lowering yield. In contrast, High-NA EUV can achieve 8nm resolution in a single step, improving production efficiency.
While TSMC and Samsung remain hesitant, Intel's early investment in High-NA EUV could give it a competitive advantage in leading-edge semiconductor manufacturing. The company's first-mover status allows it to establish industry standards for High-NA EUV technology before competitors fully adopt the process.
