China's First Fully Domestic High-Performance Automotive-Grade MCU Chip Released
Recently, China's first fully domestically developed high-performance automotive-grade MCU chip, the DF30, was officially released. According to information published by Wuhan Economic Development Zone, this automotive-grade chip was launched by the Hubei Province Automotive-Grade Chip Industry Technology Innovation Consortium, filling a domestic gap in the market.
Recently, China's first fully domestically developed high-performance automotive-grade MCU chip, the DF30, was officially released. According to information published by Wuhan Economic Development Zone, this automotive-grade chip was launched by the Hubei Province Automotive-Grade Chip Industry Technology Innovation Consortium, filling a domestic gap in the market.
The DF30 chip is the industry's first high-end automotive-grade MCU based on a self-developed open-source RISC-V multicore architecture, developed using a domestic 40nm automotive process in a fully closed-loop domestic workflow. It has achieved ASIL-D functional safety level and passed 295 rigorous tests.
The DF30 chip is compatible with the domestically developed AutoSAR automotive software operating system and can be widely used in fields such as power control, chassis, electronic information, and driver assistance.
The Hubei Province Automotive-Grade Chip Industry Technology Innovation Consortium, led by Dongfeng Motor and other domestic semiconductor companies, was formed in May 2022. It aims to combine efforts from government, industry, academia, and research to achieve fully autonomous definition, design, manufacturing, packaging, and testing of automotive-grade chips, as well as controller development and applications. The goal is to complete the automotive-grade chip industry chain, deepen industry-academia-research collaboration, and accelerate breakthroughs in innovation.
To date, the consortium has expanded to 44 members, covering the entire automotive-grade chip industry chain, including standards, design, manufacturing, packaging, and application.
