Intel Foundry Expands Global Strategy and Ecosystem at 2025 Intel Foundry Direct Connect

On April 30, the 2025 Intel Foundry Direct Connect event kicked off with Intel showcasing major progress in its next-generation process nodes and advanced packaging technologies. The company also announced new ecosystem partnerships and customer collaborations as it continues evolving into a world-class foundry business.

The conference gathered key industry leaders to discuss how Intel’s system-level foundry model is driving collaborative innovation and empowering customers to accelerate development of cutting-edge technologies.

Intel Sharpens Foundry Focus and Deepens Collaboration

Intel CEO Lip-Bu Tan delivered the keynote, outlining Intel Foundry's strategic vision and highlighting its transition to the next phase of growth. He emphasized Intel's customer-first philosophy, ecosystem collaboration, and a culture centered on engineering excellence.

Intel Foundry CTO Naga Chandrasekaran and GM of Foundry Services Kevin O’Buckley followed with updates on Intel’s process technologies and global manufacturing network. They highlighted progress on Intel 18A and Intel 14A nodes, as well as expanded foundry capabilities backed by a robust ecosystem.

Representatives from Synopsys, Cadence, Siemens EDA, and PDF Solutions joined the keynote, underscoring their roles as trusted ecosystem partners. Executives from MediaTek, Microsoft, and Qualcomm also shared insights on their work with Intel’s foundry services.

Intel 14A and 18A: Next-Gen Process Nodes

Intel confirmed early customer engagement for its Intel 14A process node, including the delivery of Process Design Kits (PDKs). Intel 14A will leverage PowerDirect power delivery, improving upon the PowerVia technology used in Intel 18A.

Meanwhile, Intel 18A has entered risk production and is on track for volume manufacturing later in 2025. The process has full support from EDA partners and IP libraries, enabling customers to begin design work now.

Intel also introduced Intel 18A-P and Intel 18A-PT, two performance-enhanced variants designed to give customers additional headroom for innovation. Intel 18A-P is currently producing early wafers, while 18A-PT incorporates Foveros Direct 3D packaging, with hybrid bonding interconnects under 5 microns.

Additionally, Intel has begun production of its first 16nm node products and is negotiating customer engagements around the co-developed 12nm node with UMC and future iterations.

Manufacturing and Global Footprint Expansion

Intel’s Fab 52 in Arizona has successfully completed initial Intel 18A wafer runs, marking a critical milestone toward mass production. Full-scale volume ramp-up will begin first in Oregon, with Arizona’s high-volume manufacturing expected later in 2025.

Intel’s manufacturing network is strategically aligned with its global foundry ambitions, offering diverse capacity and resilient supply chain operations.

Strengthening the Intel Foundry Ecosystem

Intel’s ecosystem continues to grow under its Foundry Accelerator Alliance, which now includes two new arms: the Chiplet Alliance and the Value Chain Alliance.

The Intel Foundry Chiplet Alliance will focus on defining interoperable, secure chiplet standards to enable scalable design solutions for diverse market segments. This initiative supports Intel’s vision for modular and reusable IP integration, empowering customers to innovate across AI, data center, automotive, and edge computing applications.

Outlook

As the semiconductor industry shifts toward modular design and system-level innovation, Intel’s foundry strategy represents a bold move to diversify its business model, build customer trust, and compete with established players in advanced manufacturing. The integration of cutting-edge packaging, global capacity expansion, and deep ecosystem partnerships positions Intel Foundry to play a major role in shaping the next era of chip design and manufacturing.