Semiconductor Equipment Developer Xiner Technology Commences Phase II Plant Expansion
Recently, Xiner Technology announced the commencement of its Phase II plant expansion at the Emerging Industrial Park. The new facility will cover an area of 2,000 square meters, primarily housing a Class 100 cleanroom. This expansion aims to enhance the development and manufacturing capabilities for high-end equipment, including 12-inch temporary bonding and debonding, permanent bonding, and hybrid bonding machines.
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Founded in February 2021, Suzhou Xiner Technology is a semiconductor equipment developer. The company independently develops and manufactures specialized semiconductor equipment, acts as a distributor for both domestic and international semiconductor manufacturing equipment, and provides services for upgrading and refurbishing used equipment, disassembly, and trading of consumables.
In December 2022, Xiner Technology established a Class 1,000 ultra-clean workshop and office in Suzhou Industrial Park, intended for the research and production of large-size bonding equipment and laser bonding devices.
Xiner Technology's product applications span across various fields of the semiconductor industry, with process capabilities covering 2 to 12 inches. The company provides comprehensive solutions for temporary and permanent bonding and has already delivered nearly 100 units of compound semiconductor bonding equipment. In 2023, it introduced the 12-inch temporary bonding and debonding equipment for 2.5D/3D packaging.
