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Huawei’s Hubble Invests in Two Strategic Tech Firms to Strengthen Robotics and Simulation CapabilitiesNews

Huawei’s Hubble Invests in Two Strategic Tech Firms to Strengthen Robotics and Simulation Capabilities

Huawei’s investment arm, Hubble Technology Investment, has made two new strategic moves in May 2025, expanding its presence in cutting-edge technology domains. The company has invested in Qianxun Intelligent, a startup focused on embodied AI and humanoid robotics, and Tongyuan SoftControl, a leader in cyber-physical system simulation software. These investments underscore Huawei’s continued commitment to building a robust technological ecosystem across AI, robotics, and advanced industrial software.

GlobalWafers to Launch First U.S. 12-Inch Silicon Wafer Fab on May 15News

GlobalWafers to Launch First U.S. 12-Inch Silicon Wafer Fab on May 15

May 13, 2025 — GlobalWafers, the world’s third-largest semiconductor wafer supplier, is set to officially open its new state-of-the-art facility in Texas on May 15, marking a historic milestone as the first 12-inch silicon wafer production plant in the United States. The new factory is expected to begin contributing to the company’s revenue in the second half of 2025.

NEO Semiconductor Unveils Next-Gen 3D X-DRAM Aiming to Boost DRAM Density by 10xNews

NEO Semiconductor Unveils Next-Gen 3D X-DRAM Aiming to Boost DRAM Density by 10x

May 9, 2025 — U.S.-based memory innovator NEO Semiconductor has announced a major leap in dynamic random-access memory (DRAM) architecture with the launch of its new-generation 3D X-DRAM technology, featuring the industry’s first 1T1C and 3T0C 3D DRAM cell designs. This breakthrough is set to redefine memory performance and scalability for high-demand applications in AI, edge computing, and in-memory processing.

EU Launches "Chips Act 2.0" to Revitalize Semiconductor Ambitions Amid 2030 Goal DoubtsNews

EU Launches "Chips Act 2.0" to Revitalize Semiconductor Ambitions Amid 2030 Goal Doubts

The European Union is preparing a strategic upgrade to its semiconductor policy through the introduction of the “EU Chips Act 2.0”, aiming to address mounting concerns over the bloc's ability to meet its 2030 chip production targets. The original Chips Act, which came into effect in 2023, set the ambitious goal of doubling Europe’s share of global semiconductor production to 20%. However, industry insiders and auditors now warn that this target is unlikely to be reached without major structural changes.

Samsung’s Harman Acquires Masimo’s Audio Division for $350 Million to Strengthen Automotive Tech FootprintNews

Samsung’s Harman Acquires Masimo’s Audio Division for $350 Million to Strengthen Automotive Tech Footprint

May 9, 2025 — Samsung Electronics’ subsidiary Harman International has announced a strategic acquisition of the audio division of U.S.-based Masimo Corporation for $350 million, further cementing its position in the global automotive and consumer electronics markets. The deal marks a significant move in Samsung's ongoing expansion strategy and has sparked speculation around more tech-focused acquisitions in the near future.

Qualcomm Snapdragon 8 Elite Gen 2 to Debut in September with TSMC N3P Node and Major Performance BoostNews

Qualcomm Snapdragon 8 Elite Gen 2 to Debut in September with TSMC N3P Node and Major Performance Boost

Qualcomm is expected to unveil its next-generation flagship mobile chipset — the Snapdragon 8 Elite Gen 2 — during its Snapdragon Tech Summit, which has been rescheduled earlier this year for September 2025. Ahead of the official launch, key details about the chipset’s architecture and performance enhancements have surfaced, setting the stage for a major leap in mobile computing power.

UK Launches Europe’s First and the World’s Second Electron Beam Lithography FacilityNews

UK Launches Europe’s First and the World’s Second Electron Beam Lithography Facility

May 8, 2025 — In a major technological leap for Europe’s semiconductor industry, the University of Southampton in the United Kingdom has officially launched the continent’s first advanced semiconductor fabrication facility powered by electron beam lithography (EBL). The site now houses the world’s second EBL machine of its kind, marking a key milestone in next-generation chipmaking.

TSMC Breaks Ground on Third Arizona Fab, Escalating Advanced Chip Manufacturing in the U.S.News

TSMC Breaks Ground on Third Arizona Fab, Escalating Advanced Chip Manufacturing in the U.S.

TSMC Arizona has officially begun construction on its third semiconductor fabrication facility in Phoenix, signaling the company’s deepening commitment to building a comprehensive and cutting-edge chip manufacturing hub in the United States. This third fab will sit adjacent to TSMC’s first two facilities, which are scheduled to begin production in 2025 and 2026 with 4nm and 3nm process technologies, respectively.

Adani Pauses $10 Billion Semiconductor Plant Project with Tower Semiconductor in IndiaNews

Adani Pauses $10 Billion Semiconductor Plant Project with Tower Semiconductor in India

India’s ambitious semiconductor manufacturing vision has encountered another major setback as the Adani Group has reportedly paused its $10 billion partnership with Israel-based Tower Semiconductor. The project, which aimed to establish a large-scale wafer fabrication facility in Panvel, Maharashtra, was expected to produce 80,000 wafers per month, focusing on the analog and mixed-signal chip market.