1:Integra invested 1.8 billion US dollars to build the largest packaging plant in the United States
1:Integra invested 1.8 billion US dollars to build the largest packaging plant in the United StatesRelated Articles
NewsHuawei’s Hubble Invests in Two Strategic Tech Firms to Strengthen Robotics and Simulation Capabilities
Huawei’s investment arm, Hubble Technology Investment, has made two new strategic moves in May 2025, expanding its presence in cutting-edge technology domains. The company has invested in Qianxun Intelligent, a startup focused on embodied AI and humanoid robotics, and Tongyuan SoftControl, a leader in cyber-physical system simulation software. These investments underscore Huawei’s continued commitment to building a robust technological ecosystem across AI, robotics, and advanced industrial software.
NewsGlobalWafers to Launch First U.S. 12-Inch Silicon Wafer Fab on May 15
May 13, 2025 — GlobalWafers, the world’s third-largest semiconductor wafer supplier, is set to officially open its new state-of-the-art facility in Texas on May 15, marking a historic milestone as the first 12-inch silicon wafer production plant in the United States. The new factory is expected to begin contributing to the company’s revenue in the second half of 2025.
NewsSamsung’s Harman Acquires Masimo’s Audio Division for $350 Million to Strengthen Automotive Tech Footprint
May 9, 2025 — Samsung Electronics’ subsidiary Harman International has announced a strategic acquisition of the audio division of U.S.-based Masimo Corporation for $350 million, further cementing its position in the global automotive and consumer electronics markets. The deal marks a significant move in Samsung's ongoing expansion strategy and has sparked speculation around more tech-focused acquisitions in the near future.
NewsPSMC Unveils 3D AI Semiconductor Solutions with Key Partners at COMPUTEX 2025
May 13, 2025 — Taiwanese foundry Powerchip Semiconductor Manufacturing Corp. (PSMC) announced that it will showcase a comprehensive suite of 3D AI semiconductor solutions at COMPUTEX Taipei 2025, partnering with key supply chain collaborators including Etron Technology, Winbond, ITRI, Ardentec, Skymizer, Mantex, Zentel, and Powerchip Microelectronics.
NewsQualcomm Snapdragon 8 Elite Gen 2 to Debut in September with TSMC N3P Node and Major Performance Boost
Qualcomm is expected to unveil its next-generation flagship mobile chipset — the Snapdragon 8 Elite Gen 2 — during its Snapdragon Tech Summit, which has been rescheduled earlier this year for September 2025. Ahead of the official launch, key details about the chipset’s architecture and performance enhancements have surfaced, setting the stage for a major leap in mobile computing power.
NewsEU Launches "Chips Act 2.0" to Revitalize Semiconductor Ambitions Amid 2030 Goal Doubts
The European Union is preparing a strategic upgrade to its semiconductor policy through the introduction of the “EU Chips Act 2.0”, aiming to address mounting concerns over the bloc's ability to meet its 2030 chip production targets. The original Chips Act, which came into effect in 2023, set the ambitious goal of doubling Europe’s share of global semiconductor production to 20%. However, industry insiders and auditors now warn that this target is unlikely to be reached without major structural changes.

