153 articles
NewsOn April 23, Sharp Corporation announced plans to sell its semiconductor business, Sharp Fukuyama Laser (SFL), to Foxconn’s investment arm, Hongyuan International Investment, for 15.5 billion yen (approximately $1 billion TWD). The transaction is scheduled for completion by September 29, 2025.
NewsIn a landmark move for Europe’s semiconductor sector, German memory specialist Neumonda has announced a strategic partnership with FMC (Ferroelectric Memory Company) to launch a new non-volatile memory production line in Dresden. This initiative marks Germany’s first attempt to restart domestic DRAM manufacturing since the collapse of Qimonda in 2009.
NewsApple’s upcoming iPhone 18 series is rumored to take a major leap forward in chip performance, as both prominent supply chain analysts Ming-Chi Kuo and Jeff Pu now confirm that the device’s A20 processor will be manufactured using TSMC’s cutting-edge 2nm process technology.
NewsOn March 20, Microchip Technology (NASDAQ: MCHP) announced its plan to sell its Wafer Fab 2 facility located in Tempe, Arizona. The company has appointed Macquarie Group to lead the marketing and sale of the fab as part of a broader manufacturing reorganization strategy aimed at improving operational efficiency and profitability.
NewsMarch 14, 2025 – Despite reports that Google is collaborating with MediaTek on its next-generation Tensor Processing Units (TPUs), Broadcom remains a key supplier, securing orders for Google’s upcoming TPU v7 series, which is expected to launch in 2026.
NewsWith the rapid advancement of AI-driven applications, the demand for high-speed data processing and memory performance has surged. In response to this growing need, T-Force (JinTaiKe) has officially launched its Wenquxing DDR5 memory series, offering high-frequency, large-capacity RAM modules designed to empower gamers, content creators, and professionals alike.
NewsFebruary 26, 2025 – SkyWater Technology has announced a strategic agreement to acquire Infineon's 200mm (8-inch) Fab 25 in Austin, Texas. This acquisition will significantly boost U.S. semiconductor manufacturing capacity, particularly in 130nm to 65nm process nodes, strengthening SkyWater’s role as a key domestic foundry.
NewsFebruary 21, 2025 – Foxconn (Hon Hai Precision Industry Co., Ltd.) has officially acquired a 25% stake in Goertek Electronics Vietnam Co., Ltd. for $50 million, marking a strategic investment to expand its presence in Southeast Asia. The transaction, completed on February 21, 2025, was negotiated based on book value and involved no brokerage fees.
NewsAs semiconductor technology continues to evolve, advanced packaging has emerged as a critical battleground for industry leaders. The need for higher interconnect density and process integration has driven substantial investments from key players. Companies such as Powertech Technology (PTI), Amkor, Unisoc, and ZhiJu Semiconductor are ramping up production, while TSMC and Samsung continue to push technological advancements. With increasing competition, the advanced packaging sector is witnessing rapid innovation and market expansion.
NewsAs the silicon carbide (SiC) industry enters a critical development phase in 2025, the shift toward 8-inch wafer production is accelerating. This transformation is fueling increased demand for high-precision semiconductor equipment. Following the successful delivery of 30 sets of SiC epitaxy equipment by CETC (China Electronics Technology Group Corporation), another major development has emerged—Zhongdao Optoelectronics has secured repeat orders from a leading SiC customer for its advanced defect detection systems.
NewsCES 2025 is in full swing, with AI once again dominating the spotlight. Major semiconductor players like Qualcomm, MediaTek, NVIDIA, Intel, AMD, SK hynix, and Black Sesame Technologies have showcased cutting-edge innovations, including SoCs, CPUs, GPUs, and memory solutions. These advancements, closely aligned with AI trends, are delivering significant performance upgrades and capturing widespread attention.
NewsAccording to a report by the Chosun Ilbo, Samsung's Device Solutions (DS) Division recently completed the design of a high-bandwidth memory 4 (HBM4) logic chip. The company's Foundry Division has commenced trial production using its 4nm process, marking a significant milestone in Samsung's efforts to regain leadership in the HBM market. The final performance validation of the logic chip will pave the way for HBM4 sample testing.