Hot news last week
1: PC chip market may slow down for a long time
Affected by the slump of the consumer electronics market, the chip cold wave continues to sweep the global semiconductor industry, especially the PC chip market.
At present, the latest financial reports released by major PC chip manufacturers such as AMD and Intel show that the PC chip market demand is still weak and the long-term development may slow down.
2: Samsung, Intel, IBM and Ericsson are jointly developing the next generation of chips
Industry news shows that Samsung, Intel, IBM and Ericsson are jointly researching and developing the next generation of chips. The cooperation project also received US $50 million from the National Science Foundation (NSF).
It is reported that the cooperation fields of Samsung, Intel, IBM and Ericsson include equipment performance, chip and system level, recyclability, environmental impact and manufacturability.
3: The world's largest factory is coming, and silicon carbide ushers in a "bright moment"
Recently, several media reported that Wolfspeed, a semiconductor manufacturer, plans to build a semiconductor factory in Salzburg, Germany. The report also said that the factory is expected to become the largest silicon carbide semiconductor factory in the world after completion.
Now, this news has been confirmed by Wolfspeed. On February 2 local time, Wolfspeed announced on its official website that it planned to build the world's largest and most advanced silicon carbide device manufacturing plant in Salzburg, Germany, to support the growing demand for various automotive, industrial and energy applications.
4: Nano and micro semiconductors announced to work with KATEK to accelerate the popularization of high-efficiency and low-cost solar applications
Torrens, California, USA, and Meimingen, Germany, January 27, 2023 -- Microelectronics (NASDAQ stock code: NVTS) and KATEK Group (Frankfurt Stock Exchange code: KTEK) jointly announced that:
The Steca solar inverter of KATEK's coolcept flex series uses the new and leading power semiconductor of GeneSiC to effectively optimize efficiency, size, weight and cost, which will further accelerate the expansion of market share.
5: Infineon and Resonac signed a new purchase cooperation order, focusing on silicon carbide
Infineon announced that it was expanding its cooperation with silicon carbide (SiC) suppliers, and had signed a new procurement cooperation long order with Resonac to supplement and expand the contract signed by both parties in 2021.
Angelique van der Burg, chief procurement officer of Infineon, said that the demand for silicon carbide was growing rapidly and the company was preparing for it.
