Over 10 Major Semiconductor Projects Bloom Across China!
Over 10 Major Semiconductor Projects Bloom Across China!
Recently, numerous semiconductor projects in China have achieved significant milestones, including signing agreements, groundbreakings, project topping-outs, completions, and commencements of production. These projects encompass a wide range of sectors, including storage, packaging, materials, equipment, and compound semiconductors.
1. ACM’s Lingang R&D and Manufacturing Center Welcomes Its First Metrology Equipment
On October 21, ACM Semiconductor's new R&D and manufacturing center completed construction and began operations. Just nine days later, on October 30, ACM Shanghai announced another milestone as its Lingang center welcomed its first metrology device, the KLA-Tencor Surfscan SP7, in its clean room. The Lingang project includes five units: two R&D buildings, two high-rise factory buildings, and an auxiliary facility, with a total area of 138,000 square meters. The facilities feature intelligent logistics and storage systems, projected to produce 300-400 units annually, with a potential output of 5 billion RMB.
By 2025, when the second factory building (Plant B) is operational, ACM expects to double its production capacity, positioning itself within the top tier of international integrated circuit equipment providers.
2. Lixin Semiconductor Storage Manufacturing Base Begins Production
On October 28, Lixin (Yangzhou) semiconductor storage base officially began operations. With a total investment of 1 billion RMB, the project will be executed in two phases, featuring production lines for SATA3 2.5 storage, PCIe high-speed hard drives, and DDR4/DDR5 memory chips. The project is anticipated to generate a 5-year cumulative sales of 2.5 billion RMB and tax contributions nearing 100 million RMB.
3. Pangu Semiconductor’s Advanced Packaging Project Tops Out
In Jiangsu, Pangu Semiconductor's advanced packaging project has achieved a significant milestone with its structure topping out. With a total investment of 3 billion RMB, this project is expected to support a diverse range of applications in fields such as 5G, IoT, and consumer electronics.
4. Taicang Xincheng Semiconductor Launches Production
On October 28, Taicang Xincheng Semiconductor launched production at its Taicang site. This facility, with an estimated annual capacity of 80 million optical chips and production value of 1 billion RMB, specializes in VCSEL and EEL laser chips used in fields like optical communication, biomedical, and advanced equipment.
5. China’s First Glass-Based Semiconductor Production Line Launches in Chongqing
Bochip Semiconductor in Chongqing introduced China’s first glass-based semiconductor line on October 28. This cutting-edge line, scheduled for full operation in early 2025, targets the high-precision semiconductor sector with applications across AI, automotive electronics, and energy sectors.
6. Qingdao Pingxin CMP Material Project Commences Production
Shanghai Runping Materials’ CMP polishing base, located in Qingdao, has started production as of October 25, aiming to supply CMP materials and polished heads for semiconductor manufacturing, contributing to the integrity of China’s integrated circuit supply chain.
7. Zunyang IC Testing Base Phase II Project Tops Out
In Wuxi, Jiangsu, Zunyang Electronics has topped out Phase II of its IC testing base. This project targets a yearly production of 30 billion standardized IC units, positioning Zunyang as a key player in China’s growing semiconductor ecosystem.
8. Yuhao Semiconductor’s Intelligent Manufacturing Project Begins Construction
In Qingdao, Yuhao Semiconductor began groundwork for its intelligent manufacturing project, which will produce advanced chip diffusion furnaces and other semiconductor components. Upon completion in 2026, this project aims for an annual production value of 800 million RMB.
9. Vanchip Semiconductor’s 3-Inch Compound Chip Manufacturing Facility Tops Out
Vanchip Semiconductor’s 3-inch compound chip facility achieved structural completion on October 23, marking a step closer to production of GaAs and InP chips for consumer electronics and automotive applications.
10. Huaxin Zichen Compound Crystal Industrialization Project Breaks Ground in Ningxia
In partnership with China Nuclear Energy, Huaxin Zichen commenced its compound semiconductor crystal project in Ningxia. This project is dedicated to producing components for high-performance applications like 5G communications and display technologies, with phase one set for completion by late 2025.
11. Puchuang Semiconductor Industrial Park Completes Construction
Dongguan-based Puchuang Semiconductor completed its advanced semiconductor equipment industrial park on October 26. This facility focuses on high-end IC packaging equipment and serves as a strategic asset in Dongguan’s initiative to bolster its semiconductor and electronics manufacturing capabilities.
Each of these projects underscores the dynamic growth in China’s semiconductor and electronic component industries, contributing to technological advancements and positioning China at the forefront of global semiconductor manufacturing.
