Annual Production to Reach 6 Million Units: Xinci Technology's Ceramic Substrate Project Officially Launched

January 2025 – Xinci Technology has announced the official commencement of production for its ceramic substrate project in Jinyi New District, Zhejiang Province. The project marks a significant milestone for the semiconductor materials sector in China.

January 2025 – Xinci Technology has announced the official commencement of production for its ceramic substrate project in Jinyi New District, Zhejiang Province. The project marks a significant milestone for the semiconductor materials sector in China.

Project Overview

Investment: ¥1 billion

Facility Size: Approx. 32,000 square meters

Production Target: 6 million DPC (Direct-Plated Copper) ceramic substrates annually

Projected Annual Revenue: ¥900 million

The project was initially signed in March 2023 and completed equipment commissioning and trial operations by November 2024, signaling readiness for large-scale production.

Key Product: DPC Ceramic Substrates

DPC ceramic substrates are essential in the semiconductor power device industry. These substrates significantly enhance device performance and thermal management capabilities, which are crucial for high-power and high-efficiency applications.

Technical Highlights:

Material: High-thermal-conductivity ceramic substrates

Processes: Combines thin-film metallization, photolithography, vertical interconnects, and 3D stacking technologies.

Applications:

High-power LED lighting

Semiconductor lasers (VCSEL)

5G communication modules (PA)

Insulated-gate bipolar transistors (IGBT)

MEMS sensors

Concentrated photovoltaic (CPV) systems

Xinci Technology’s 3D-formed DPC ceramic substrates are highly regarded for their innovative integration of multiple core semiconductor technologies, making them an ideal choice for third-generation semiconductor power device packaging and next-generation wafer-level packaging.

Industry Impact

The official launch of this high-capacity facility is expected to:

  1. Strengthen China’s position in semiconductor materials manufacturing.
  2. Boost local semiconductor ecosystem development, including downstream industries like high-power LEDs and 5G communication modules.
  3. Foster technological advancement in third-generation semiconductor applications, including electric vehicles, renewable energy systems, and high-frequency communication devices.

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