PSMC Unveils 3D AI Semiconductor Solutions with Key Partners at COMPUTEX 2025
May 13, 2025 — Taiwanese foundry Powerchip Semiconductor Manufacturing Corp. (PSMC) announced that it will showcase a comprehensive suite of 3D AI semiconductor solutions at COMPUTEX Taipei 2025, partnering with key supply chain collaborators including Etron Technology, Winbond, ITRI, Ardentec, Skymizer, Mantex, Zentel, and Powerchip Microelectronics.
May 13, 2025 — Taiwanese foundry Powerchip Semiconductor Manufacturing Corp. (PSMC) announced that it will showcase a comprehensive suite of 3D AI semiconductor solutions at COMPUTEX Taipei 2025, partnering with key supply chain collaborators including Etron Technology, Winbond, ITRI, Ardentec, Skymizer, Mantex, Zentel, and Powerchip Microelectronics.
At a pre-show press conference on May 12, PSMC revealed that the collaborative display will focus on two major AI application markets: large language model inference and image recognition. The demonstration will span from IP and IC design services to high-bandwidth memory architecture, compute-in-memory integration, power management chips, and advanced 3D wafer stacking and packaging technologies.
Spotlight on Partner Technologies
Etron Technology will showcase multi-layer high-bandwidth memory interposers supporting SoC (System-on-Chip) integration, enhancing system performance and flexibility.
Winbond will debut its aiPIM solution, vertically integrating memory modules with AI cores to streamline inference workloads.
Zentel will present RD-LE-HBM, a high-bandwidth, low-power memory solution optimized for edge AI processing scenarios.
In the realm of IP and IC integration:
Skymizer will demonstrate its HyperThought AI accelerator IP, targeting energy-efficient performance.
Mantex will feature optimized AI IP for language model acceleration.
ITRI will reveal MOSAIC, a collaborative 3D AI chip developed with PSMC, showcasing breakthroughs in compute-in-memory through advanced 3D stacking.
Ardentec will highlight IC design service capabilities by integrating Arm processors with DRAM using wafer stacking technology.
PSMC’s 3D AI Strategy
According to PSMC Chairman Frank Huang, the company’s Wafer-on-Wafer (WoW) stacking technology has already entered the validation phase with global tier-one logic foundries and customers. Its interposer products are also in high demand, with successful volume production underway.
PSMC emphasized that this joint 3D AI platform not only consolidates Taiwan’s semiconductor ecosystem but also opens up new opportunities for global AI system developers seeking innovative, vertically integrated AI solutions.
