Hi2120
Hi2120 Hisilicon
Hi2120 Hisilicon
Key Features
Communications Protocols• BLE 5.0 • 3GPP Release 13/14/15 NB-IoT (supporting upgrades to Release 16) • Category NB2, 2HARQ |
RF• BLE 5.0 • Supported frequency bands: • NB-IoT: 1, 2, 3, 4, 5, 8, 12, 13, 14, 17, 18, 19, 20, 25, 26, 28, 31, 65, 66, 70, 71, 72, 73 • BLE: 2400–2483.5 MHz • Integrated industry-leading, highly efficient PA |
CPUs• 3x in-house CPUs (security CPU, application CPU, and protocol CPU), all packed with the memory protection unit (MPU) • Configurable CPU frequency (applicable to application and protocol CPUs) |
Memory• Flash memory: 2 MB/4 MB • RAM: 64 KB |
System• I/O voltage: 1.5 V, 1.8 V, 2.1 V, 2.7 V, 3.0 V, or 3.3 V • Clock source: 26 MHz or 38.4 MHz crystal oscillator, with support for external 32 kHz crystal oscillators • 48-bit timer with a clock frequency of 32 kHz |
Peripherals• Up to 40x GPIOs • Up to 4x UARTs, with configurable baud rates • 1x low-power UART capable of working in deep sleep mode • 3x PWM outputs for different modes and capable of working in deep sleep mode; 1 PWM in the always-on domain • 3x SPIs with support for master/slave mode • 1x JTAG/SWD bus • 4x I²Cs • 1x 8-channel DMA • 5x programmable analog I/Os • 2x comparators with configurable thresholds • 1x capacitive touch sensor • 1x 12-bit 5-channel ADC • 1x 10-bit DAC • 1x temperature sensor |
Energy Efficiency• PSM mode (RAM off): approximately 1 μA • PSM mode (RAM on): approximately 2 μA • RX mode: 0.12 mA ([email protected] average current) • TX mode: approximately 170 mA@23 dBm |
Security• Secure boot, secure update, secure storage, secure debugging, secure running, and secure transmission • True random number generation • Hardware password: Advanced Encryption Standard (AES), Secure Hash Algorithm (SHA) • Hardware public key encryption (PKE): elliptic curve cryptography (ECC), Rivest-Shamir-Adleman (RSA) • OTP |
Application• OpenCPU • IPv4, IPv6, and non-IP • User Datagram Protocol (UDP), Transmission Control Protocol (TCP) • Datagram Transport Layer Security (DTLS), DTLS+, Transport Layer Security (TLS) • Message Queuing Telemetry Transport (MQTT), Constrained Application Protocol (CoAP) • Lightweight Machine to Machine (LwM2M) • Firmware over-the-air (FOTA) |
Packaging• 6.9 mm x 5.4 mm ball grid array (BGA) package, 1.05 mm height |
技術サポート
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