Electronics Component News, Market Trends & Supply Chain Updates
NewsSamsung Electronics has officially secured a $4.745 billion subsidy from the U.S. government under the CHIPS and Science Act. This figure, recently confirmed by the U.S. Department of Commerce, is approximately 26% lower than the $6.4 billion initially outlined in the Preliminary Memorandum of Terms (PMT) signed in April 2023.
NewsIn a groundbreaking development for the semiconductor industry, Japan’s Rapidus has successfully begun installing its first ASML EUV lithography machine, becoming the country’s first semiconductor company to adopt this cutting-edge technology. This milestone positions Japan as a serious contender in the global race for advanced chip manufacturing.
NewsDecember 18, 2024 – Longsys Advanced's Wuhan Base marked a significant milestone as it welcomed the first batch of equipment into its facilities, signaling the start of its process validation phase. This major step brings the company closer to its goal of achieving full-scale production of silicon carbide (SiC) wafers by May 2025. The project is part of Longsys's strategy to strengthen its leadership in third-generation semiconductor manufacturing.
NewsOn December 12, Yicun Capital Co., Ltd., Wuxi Innovation Investment Group Co., Ltd., and Wuxi Liangxi Science and Technology City Innovation Investment Co., Ltd. announced the establishment of the Wuxi Bit Songling Artificial Intelligence Venture Capital Fund ("Bit Songling Fund"). The fund has completed its business registration, with an initial capital of 500 million RMB. It aims to support pioneering entrepreneurs in the field of artificial intelligence (AI) and foster a generation of top-tier AI companies.
NewsOn December 17, EEnews Europe reported that the Spanish government has secured approval from the European Commission to grant €81 million (approximately 613 million RMB) in subsidies to the Spanish subsidiary of Diamond Foundry, a US-based synthetic diamond manufacturer. This funding will support the construction of an $850 million (approximately 6.2 billion RMB) diamond wafer fabrication plant in Trujillo, Spain.
NewsAccording to a report by German media outlet ComputerBase, certain capacities of the Crucial MX500 SATA SSD, a classic consumer-grade solid-state drive from Micron’s Crucial, have reached End of Life (EOL) status.
NewsResearchers at MIT have unveiled a groundbreaking multi-layer chip design in the latest issue of Nature. This innovative stacking technology dramatically increases the number of transistors on a chip, paving the way for more efficient AI hardware. By adopting a novel approach, the team successfully fabricated multi-layer chips, where high-quality semiconductor material layers are alternately grown and stacked directly on top of each other.
NewsDecember 18, 2024 – Gree Electric Appliances has officially announced the completion and production commencement of its silicon carbide (SiC) chip factory, marking a significant milestone in its chip manufacturing ambitions. The announcement was made by Gree Chairwoman Dong Mingzhu during an episode of Zhen Zhi Zhuo Jian, where she declared, “Gree’s chips have succeeded.”
NewsGlobal semiconductor wafer leader GlobalWafers and automotive supplier Bosch have unveiled plans to expand their operations with significant funding from the U.S. CHIPS Act. These investments focus on advancing 12-inch silicon wafers and 8-inch silicon carbide (SiC) wafers, critical components for next-generation semiconductors and power electronics.
NewsReports from Wccftech suggested that TSMC was assisting Intel with its advanced process manufacturing challenges, citing comments made by Rick Cassidy, TSMC’s Chairman in the U.S., during an interview with CNBC. However, TSMC swiftly denied these claims, issuing a statement to clarify its position.
NewsOn December 16, 2024, Beijing announced plans to establish the Beijing Integrated Circuit Equipment Industry Investment and M&A Phase II Fund, with a total scale of 3 billion yuan. This move follows the success of the first phase, launched in 2020, and aims to further support the semiconductor industry’s development through mergers, acquisitions, and strategic investments.
NewsOn December 17, 2024, Dongshan Precision Manufacturing Co., Ltd. announced its revised 2024 private placement plan to issue A shares to specific investors, aiming to raise a maximum of 1.404 billion yuan. The funding will be used to supplement working capital, enhancing the company’s financial stability and operational efficiency.