137 articles
NewsMarch 14, 2025 – Despite reports that Google is collaborating with MediaTek on its next-generation Tensor Processing Units (TPUs), Broadcom remains a key supplier, securing orders for Google’s upcoming TPU v7 series, which is expected to launch in 2026.
NewsWith the rapid advancement of AI-driven applications, the demand for high-speed data processing and memory performance has surged. In response to this growing need, T-Force (JinTaiKe) has officially launched its Wenquxing DDR5 memory series, offering high-frequency, large-capacity RAM modules designed to empower gamers, content creators, and professionals alike.
NewsFebruary 26, 2025 – SkyWater Technology has announced a strategic agreement to acquire Infineon's 200mm (8-inch) Fab 25 in Austin, Texas. This acquisition will significantly boost U.S. semiconductor manufacturing capacity, particularly in 130nm to 65nm process nodes, strengthening SkyWater’s role as a key domestic foundry.
NewsFebruary 21, 2025 – Foxconn (Hon Hai Precision Industry Co., Ltd.) has officially acquired a 25% stake in Goertek Electronics Vietnam Co., Ltd. for $50 million, marking a strategic investment to expand its presence in Southeast Asia. The transaction, completed on February 21, 2025, was negotiated based on book value and involved no brokerage fees.
NewsAs semiconductor technology continues to evolve, advanced packaging has emerged as a critical battleground for industry leaders. The need for higher interconnect density and process integration has driven substantial investments from key players. Companies such as Powertech Technology (PTI), Amkor, Unisoc, and ZhiJu Semiconductor are ramping up production, while TSMC and Samsung continue to push technological advancements. With increasing competition, the advanced packaging sector is witnessing rapid innovation and market expansion.
NewsAs the silicon carbide (SiC) industry enters a critical development phase in 2025, the shift toward 8-inch wafer production is accelerating. This transformation is fueling increased demand for high-precision semiconductor equipment. Following the successful delivery of 30 sets of SiC epitaxy equipment by CETC (China Electronics Technology Group Corporation), another major development has emerged—Zhongdao Optoelectronics has secured repeat orders from a leading SiC customer for its advanced defect detection systems.
NewsCES 2025 is in full swing, with AI once again dominating the spotlight. Major semiconductor players like Qualcomm, MediaTek, NVIDIA, Intel, AMD, SK hynix, and Black Sesame Technologies have showcased cutting-edge innovations, including SoCs, CPUs, GPUs, and memory solutions. These advancements, closely aligned with AI trends, are delivering significant performance upgrades and capturing widespread attention.
NewsAccording to a report by the Chosun Ilbo, Samsung's Device Solutions (DS) Division recently completed the design of a high-bandwidth memory 4 (HBM4) logic chip. The company's Foundry Division has commenced trial production using its 4nm process, marking a significant milestone in Samsung's efforts to regain leadership in the HBM market. The final performance validation of the logic chip will pave the way for HBM4 sample testing.
NewsMicrosoft AI investment, AI data centers 2025, generative AI investment, tech giants AI spending, AI infrastructure growth, Meta AI funding, Amazon AI development, Google AI strategy, AI investment trends 2025, AI market competition.
NewsOn January 3, 2025, SK Hynix announced its participation in CES 2025, the world’s largest consumer electronics exhibition, held in Las Vegas from January 7 to 10. The company aims to demonstrate its cutting-edge AI-driven memory technology, showcasing its role as a "Full-Stack AI Memory Provider."
NewsShanghai Herch Tech, a leading player in the semiconductor industry, recently held its 2024 half-year and third-quarter earnings conference. The company highlighted its efforts to navigate market challenges while accelerating technological advancements in the development of 12-inch N-type epitaxial wafers and new customer acquisition.
NewsDecember 24, 2024 – A groundbreaking diamond fabrication technology has been developed by a collaborative team from the University of Hong Kong’s Faculty of Engineering, Southern University of Science and Technology, and Peking University. The "edge-exposed peeling method" enables rapid and large-scale production of ultra-thin, flexible diamond films, marking a significant advancement in diamond manufacturing.