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Electronics Component News, Market Trends & Supply Chain Updates

Global Chip Equipment Sales to Hit Record High in 2024News

Global Chip Equipment Sales to Hit Record High in 2024

The SEMI organization has announced that global chip equipment sales are projected to reach an all-time high of $113 billion in 2024, marking a 6.5% year-on-year increase. This estimate surpasses SEMI's mid-2023 forecast of $109 billion and exceeds the previous record of $107.4 billion set in 2022. SEMI also predicts continued growth in subsequent years, with sales rising by 7% to $121 billion in 2025 and a further 15% to $139 billion in 2026, setting new records each year.

Fujian Jingxu Semiconductor Completes Main Construction of Phase II ProjectNews

Fujian Jingxu Semiconductor Completes Main Construction of Phase II Project

Fujian Jingxu Semiconductor Technology Co., Ltd. (Jingxu Semiconductor) has achieved a significant milestone as the main factory building for its Phase II project in the Shanghang Industrial Park's Jin-Tong Industrial Zone is now complete. The project has progressed to interior and exterior wall finishing, with mechanical, electrical, and ventilation installations, along with fine-tuning, slated to begin after the Lunar New Year.

Samsung Achieves Breakthrough in 400-Layer NAND TechnologyNews

Samsung Achieves Breakthrough in 400-Layer NAND Technology

Samsung Electronics has announced a significant advancement in NAND flash memory technology with the successful development of its 400-layer NAND technology. The milestone was achieved at Samsung’s Semiconductor R&D Center, with the technology now being transferred to mass production lines at the Pyeongtaek P1 facility since November. This breakthrough positions Samsung at the forefront of NAND innovation as it competes with industry players like SK Hynix, which recently commenced production of 321-layer NAND.

China’s National Integrated Circuit Fund Makes Fourth EDA Investment of 2024 in Unicorn Firm Hangxin TechnologyNews

China’s National Integrated Circuit Fund Makes Fourth EDA Investment of 2024 in Unicorn Firm Hangxin Technology

China’s National Integrated Circuit Industry Investment Fund (commonly known as the National IC Fund) continues its strategic investment spree, marking its fourth EDA (Electronic Design Automation) funding of the year by acquiring a stake in Hangxin Technology. Earlier this year, the fund also invested in Jiu Tongfang, Shenzhen Hongxin Microelectronics, and Quanxin Intelligent Manufacturing. With this latest move, China’s EDA sector is poised for accelerated domestic development, addressing critical gaps in the industry.

CXL 3.2: New Progress in Optimizing Storage DevicesNews

CXL 3.2: New Progress in Optimizing Storage Devices

The CXL 3.2 specification was recently released by the CXL Consortium, bringing significant improvements in monitoring and management for CXL storage devices. The new version enhances the functionality of CXL storage devices in operating systems and applications, while also extending security through the Trusted Security Protocol (TSP).

7.0 Magnitude Earthquake Strikes Northern California, Impact on Semiconductor Wafer Fab FacilitiesNews

7.0 Magnitude Earthquake Strikes Northern California, Impact on Semiconductor Wafer Fab Facilities

On December 5, a 7.0 magnitude earthquake struck off the northern coast of California, near the town of Redding. The earthquake, which occurred at a depth of 10 km, has triggered tsunami warnings along California's coastline, as well as parts of Oregon. The earthquake's impact on semiconductor manufacturing facilities is being closely monitored, as several major wafer fab plants are located in the affected region.