Electronics Component News, Market Trends & Supply Chain Updates
Sanan Optoelectronics recently provided updates on its 8-inch silicon carbide (SiC) project progress at Hunan Sanan and Chongqing Sanan through an interactive platform, addressing investor inquiries.
NewsChina are in the midst of a new wave of technological transformation. With the rapid development of industries such as cloud computing, big data, and artificial intelligence, new applications and industries are continuously emerging, driving growth in smart manufacturing, digital society, and digital governance, significantly enriching data resources. As a critical medium for data storage and transmission, memory is known as the "grain of modern industry," forming the foundation of a future intelligent society and serving as a core pillar of productivity in the digital economy era.
News2024-11-21 — SK Hynix has announced the commencement of mass production of the world's highest 321-layer 1Tb (terabit) TLC (Triple Level Cell) 4D NAND flash memory.
NewsThe Japanese government is taking significant strides to boost its domestic semiconductor manufacturing industry, committing $1.3 billion (200 billion yen) in funding for chipmaker Rapidus in fiscal 2025. This move is aimed at stimulating further investment and financing from the private sector, with Rapidus aiming to achieve mass production of 2nm chips by 2027.
NewsOn November 18, global silicon carbide leader Wolfspeed announced that CEO Gregg Lowe has been removed from his position due to increasing challenges associated with the slowing demand in the electric vehicle (EV) sector. The announcement led to a roughly 6% rise in the company's stock price. Lowe, who also held the title of President, will step down from all roles, including his position on the board of directors, by the end of the month. To ensure smooth business continuity, current chairman Thomas Werner will temporarily take on the role of Executive Chairman until a suitable replacement for the CEO is appointed.
NewsHuangshan Gujie Co., Ltd. ("Huangshan Gujie") has successfully completed the registration process for its ChiNext initial public offering (IPO) on November 6, as disclosed by the Shenzhen Stock Exchange.
NewsOn November 15th, according to the official WeChat account of Basic Semiconductor, the company successfully completed its shareholding restructuring and business registration change procedures, formally changing its name to "Shenzhen Basic Semiconductor C
NewsRecent media coverage, notably from The Information, reported that NVIDIA's Blackwell architecture AI chips, designed for AI and high-performance computing (HPC), are facing overheating issues when used in servers equipped with 72 processors. These high-density servers, with power consumption reaching up to 120 kW per rack, allegedly experienced thermal management challenges that led to performance limitations and potential hardware risks. As a result, concerns were raised regarding possible delays in server deployment schedules for data centers.
NewsRecently, the Yiyuan Semiconductor Materials Industry Base Project (hereinafter referred to as the "Yiyuan Semiconductor Project") has officially broken ground in Zhuhai. According to "Zhuhai Jinwan," the total investment for the project is approximately 100 billion yuan ($14 billion). The project is incubated by the business unit of the Essie Group's ecological chain development and is led strategically by Huafa Group, aiming to build a globally competitive semiconductor materials industry base.
NewsNova Technology (HK) Co., LTD, in collaboration with IC Online, is pleased to announce the successful conclusion of our participation in Electronica 2024, held in Munich from November 12 to 15, 2024. The event was a fantastic opportunity to connect with industry experts, clients, and partners, showcasing our latest PCBA solutions and electronic components at Hall C5, Booth 531.
NewsRecently, Xiner Technology announced the commencement of its Phase II plant expansion at the Emerging Industrial Park. The new facility will cover an area of 2,000 square meters, primarily housing a Class 100 cleanroom. This expansion aims to enhance the development and manufacturing capabilities for high-end equipment, including 12-inch temporary bonding and debonding, permanent bonding, and hybrid bonding machines.
NewsOn November 12, according to an announcement on TSMC's official website, the company has approved an allocation of approximately $15.48 billion. This funding will be primarily used for the construction of new wafer fabs, installation of facility systems, and deployment of advanced node capacity.