Huangshan Gujie Completes Registration for ChiNext IPO, Plans to Raise 502 Million Yuan
Huangshan Gujie Co., Ltd. ("Huangshan Gujie") has successfully completed the registration process for its ChiNext initial public offering (IPO) on November 6, as disclosed by the Shenzhen Stock Exchange.
Huangshan Gujie Co., Ltd. ("Huangshan Gujie") has successfully completed the registration process for its ChiNext initial public offering (IPO) on November 6, as disclosed by the Shenzhen Stock Exchange.
Huangshan Gujie is a leading high-tech enterprise in China, specializing in the research, production, and sale of power semiconductor module heat dissipation substrates. These products are primarily used in the field of new energy vehicles (NEVs) as critical components in power semiconductor modules for motor controllers. Additionally, Huangshan Gujie's products have extensive applications in renewable energy and energy storage systems.
The company's main products include copper pin-type heat dissipation substrates and copper flat-bottom heat dissipation substrates. Both types are essential to the cooling systems of power semiconductor modules. The copper pin-type substrates are widely used in NEVs, whereas the copper flat-bottom substrates are applied in renewable energy generation systems.
In terms of business growth, Huangshan Gujie is the largest supplier of heat dissipation substrates for Infineon's power semiconductor modules used in NEV motor controllers. The company has also forged long-term partnerships with major industry players such as Bosch, ON Semiconductor, Hitachi, STMicroelectronics, CRRC Times, Starpower Semiconductor, Silan Microelectronics, and Chiplink. Through these partnerships and downstream automotive power module manufacturers, Huangshan Gujie's products indirectly support the electric vehicle components of numerous major NEV brands.
Huangshan Gujie's financial performance has demonstrated strong growth. The company recorded revenues of CNY 255 million in 2021, CNY 537 million in 2022, CNY 759 million in 2023, and CNY 279 million in the first half of 2024. The corresponding net profits attributable to the parent company were CNY 34 million, CNY 99 million, CNY 157 million, and CNY 61 million, respectively.
With this IPO, Huangshan Gujie aims to raise CNY 502 million, which will be used for intelligent manufacturing of power semiconductor module heat dissipation substrates, the establishment of a research and development center, and supplementary working capital.
