Solderless Breadboards13 Products
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| Image | Part Number | Manufacturer | Description | Availability | Actions | |
|---|---|---|---|---|---|---|
 PDF | GS-170-6 | B&K Precision | SOLDERLESS BREADBOARD, 170 TIE-P | In Stock | MOQ: 1 Hover to quote | |
| GS-300 | B&K Precision | SOLDERLESS BREADBOARD, 300 TIE-P | In Stock | MOQ: 1 Hover to quote | |
| GS-050 | B&K Precision | BUS STRIP, 50 TIE-POINTS (2-PACK | In Stock | MOQ: 1 Hover to quote | |
PDF | GS-170-4 | B&K Precision | SOLDERLESS BREADBOARD, 170 TIE-P | In Stock | MOQ: 1 Hover to quote | |
PDF | GS-170-2 | B&K Precision | SOLDERLESS BREADBOARD, 170 TIE-P | In Stock | MOQ: 1 Hover to quote | |
| GS-630A | B&K Precision | SOLDERLESS BREADBOARD, 630 TIE-P | In Stock | MOQ: 10 Hover to quote | |
PDF | GS-170-A | B&K Precision | GS-170: ALL EIGHT COLORS | In Stock | MOQ: 1 Hover to quote | |
PDF | GS-170-5 | B&K Precision | SOLDERLESS BREADBOARD, 170 TIE-P | In Stock | MOQ: 1 Hover to quote | |
PDF | GS-170-T | B&K Precision | SOLDERLESS BREADBOARD, 170 TIE-P | In Stock | MOQ: 1 Hover to quote | |
PDF | GS-170-3 | B&K Precision | SOLDERLESS BREADBOARD, 170 TIE-P | In Stock | MOQ: 1 Hover to quote | |
| GS-770 | B&K Precision | SOLDERLESS BREADBOARD, 770 TIE-P | In Stock | MOQ: 1 Hover to quote | |
PDF | GS-170-0 | B&K Precision | SOLDERLESS BREADBOARD, 170 TIE-P | In Stock | MOQ: 1 Hover to quote | |
PDF | GS-170-9 | B&K Precision | SOLDERLESS BREADBOARD, 170 TIE-P | In Stock | MOQ: 1 Hover to quote |
Solderless breadboard products provide a convenient means of interconnecting electronic components in hobby, educational, or development contexts, without the need for soldering or similar fixation processes. Composed of U-shaped metallic contacts positioned beneath a grid of holes in an electrically insulating housing, component leads, and wire segments inserted through the holes in the insulator are electrically connected and retained under spring tension by the contacts beneath. Though easily reconfigurable and thus ideal for experimentation, they do not provide mechanically robust interconnections, and introduce significant parasitic circuit elements which make them ill-suited for high-speed circuits.