Solderless Breadboards13 Products
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| Image | Part Number | Manufacturer | Description | Availability | Actions | |
|---|---|---|---|---|---|---|
 PDF | TW-E40-1020-P | Twin Industries | BREADBOARD HIGH TEMP 6.50X2.14" | In Stock | MOQ: 1 Hover to quote | |
 PDF | TW-E40-1020 | Twin Industries | BREADBOARD TERM STRIP 6.50X2.14" | In Stock | MOQ: 1 Hover to quote | |
 PDF | TW-E41-1020 | Twin Industries | BREADBRD TERM STRP 6.5X2.14 70PC | In Stock | MOQ: 1 Hover to quote | |
 PDF | TW-E40-510 | Twin Industries | BREADBOARD TERM STRIP 3.30X2.14" | In Stock | MOQ: 1 Hover to quote | |
 PDF | TW-E41-102B | Twin Industries | BREADBOARD ASSEM 6.5X2.14" 70PC | In Stock | MOQ: 1 Hover to quote | |
 PDF | TW-E41-1060 | Twin Industries | BREADBOARD ASSEM 6.9X5.7" 140PC | In Stock | MOQ: 1 Hover to quote | |
 PDF | TW-E41-T1 | Twin Industries | BREADBOARD ASSEMBLY 6.50X2.20" | In Stock | MOQ: 1 Hover to quote | |
 PDF | OB1-LF | Twin Industries | BREADBOARD DISTI STRIP 4X4" | In Stock | MOQ: 1 Hover to quote | |
 PDF | TW-E41-T2 | Twin Industries | BREADBOARD ASSEMBLY 6.90X5.70" | In Stock | MOQ: 1 Hover to quote | |
 PDF | OB2-LF | Twin Industries | BREADBOARD DISTI STRIP 3.47X3.4" | In Stock | MOQ: 1 Hover to quote | |
 PDF | OB3-LF | Twin Industries | BREADBOARD DISTI STRIP 6.70X3" | In Stock | MOQ: 1 Hover to quote | |
 PDF | OB2-M | Twin Industries | MODULE SOLDERLESS 5X8 | In Stock | MOQ: 1 Hover to quote | |
 PDF | TW-E40-510-P | Twin Industries | BREADBOARD HIGH TEMP 3.30X2.14" | In Stock | MOQ: 1 Hover to quote |
Solderless breadboard products provide a convenient means of interconnecting electronic components in hobby, educational, or development contexts, without the need for soldering or similar fixation processes. Composed of U-shaped metallic contacts positioned beneath a grid of holes in an electrically insulating housing, component leads, and wire segments inserted through the holes in the insulator are electrically connected and retained under spring tension by the contacts beneath. Though easily reconfigurable and thus ideal for experimentation, they do not provide mechanically robust interconnections, and introduce significant parasitic circuit elements which make them ill-suited for high-speed circuits.