Type
QFN/LFCSP
Pitch
0.031" (0.80mm)
Series
Proto-Advantage PA
Material
Stainless Steel
RoHS Compliant
Why Choose Us
Quality Warranty
Quality guarantee
ESD Safe
Anti-static protection
Global Shipping
Fast delivery
Quick Response
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MOQ1 pcs
Professional Packaging
Original Packaging
Factory sealed, ESD anti-static tray
Desiccant Protection
Humidity indicator card & silica gel included
Vacuum Sealing
Moisture barrier bag, nitrogen filled
Secure Boxing
Anti-vibration foam, shock-proof labeling
| Parameter | Value |
|---|---|
| Category | Solder Stencils, Templates |
| Manufacturer | Chip Quik Inc. |
| Type | QFN/LFCSP |
| Pitch | 0.031" (0.80mm) |
| Series | Proto-Advantage PA |
| Material | Stainless Steel |
| Packaging | Bulk |
| Thickness | 0.0040" (0.102mm) |
| Part Status | Active |
| Manufacturer | Chip Quik Inc. |
| Inner Dimension | 0.276" L x 0.276" W (7.00mm x 7.00mm) |
| Outer Dimension | 1.300" L x 0.900" W (33.02mm x 22.86mm) |
| Thermal Center Pad | - |
| Number of Positions | 28 |
Package
-
MSL
-