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THERMALLY STABLE SOLDER PASTE NOIn StockRoHS / Compliance

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TS391LT

THERMALLY STABLE SOLDER PASTE NO

Form
Syringe, 0.53 oz (15g), 5cc
Type
Solder Paste
Process
Lead Free
Flux Type
No-Clean
Datasheet (PDF)
RoHS Compliant

Why Choose Us

Quality Warranty
Quality guarantee
ESD Safe
Anti-static protection
Global Shipping
Fast delivery
Quick Response
Fast RFQ

Professional Packaging

Original Packaging

Factory sealed, ESD anti-static tray

Desiccant Protection

Humidity indicator card & silica gel included

Vacuum Sealing

Moisture barrier bag, nitrogen filled

Secure Boxing

Anti-vibration foam, shock-proof labeling

ParameterValue
CategorySolder
ManufacturerChip Quik Inc.
FormSyringe, 0.53 oz (15g), 5cc
TypeSolder Paste
Series-
ProcessLead Free
Diameter-
Flux TypeNo-Clean
Mesh Type4
PackagingBulk
Shelf Life12 Months
Wire Gauge-
CompositionBi57.6Sn42Ag0.4 (57.6/42/0.4)
Part StatusActive
ManufacturerChip Quik Inc.
Melting Point281°F (138°C)
Shipping Info-
Shelf Life StartDate of Manufacture
Base Product NumberTS391L
Storage/Refrigeration Temperature68°F ~ 77°F (20°C ~ 25°C)
Package
-
MSL
-

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