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Socket-eMMC/UFS, 153 BGA 10.0 mmIn StockRoHS / Compliance

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108387-0059

Socket-eMMC/UFS, 153 BGA 10.0 mm

Type
BGA
Packaging
Bag
Part Status
Active
Termination
Solder
Datasheet (PDF)
RoHS Compliant

Why Choose Us

Quality Warranty
Quality guarantee
ESD Safe
Anti-static protection
Global Shipping
Fast delivery
Quick Response
Fast RFQ

Professional Packaging

Original Packaging

Factory sealed, ESD anti-static tray

Desiccant Protection

Humidity indicator card & silica gel included

Vacuum Sealing

Moisture barrier bag, nitrogen filled

Secure Boxing

Anti-vibration foam, shock-proof labeling

ParameterValue
CategoryIC Sockets
ManufacturerIronwood Electronics
TypeBGA
Series-
Features-
PackagingBag
Part StatusActive
TerminationSolder
ManufacturerIronwood Electronics
Pitch - Post0.020" (0.50mm)
Mounting TypeThrough Hole
Pitch - Mating0.020" (0.50mm)
Housing Material-
Contact Resistance-
Contact Finish - Post-
Operating Temperature-
Contact Finish - Mating-
Contact Material - Post-
Termination Post Length-
Contact Material - Mating-
Material Flammability Rating-
Contact Finish Thickness - Post-
Contact Finish Thickness - Mating-
Number of Positions or Pins (Grid)153 (12 x 13)
Package
-
MSL
-

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