NewsU.S. Researchers Develop Breakthrough 3D Photonic-Electronic Chip for Next-Gen AI Hardware
A team of scientists from Columbia University, Cornell University, and partner institutions in the United States has successfully developed a revolutionary 3D photonic-electronic chip that merges cutting-edge photonics with advanced CMOS (complementary metal-oxide-semiconductor) technology. The innovation marks a significant leap toward more efficient data communication and processing in next-generation AI systems.












