Electronics Component News, Market Trends & Supply Chain Updates
NewsFoxconn's packaging subsidiary, Foxsem, is set to invest $80 million to increase its chip manufacturing capacity in Vietnam. Foxsem will contribute $20 million, with the remaining $60 million to be financed through loans, to expand its production capabilities at the Bắc Giang facility.
NewsTaiwan Semiconductor Manufacturing Company (TSMC), the world's largest semiconductor manufacturer, is set to receive ASML's most advanced High NA Extreme Ultraviolet (EUV) lithography machines before the end of the year, according to Nikkei Asia. These cutting-edge machines, priced at over $350 million each, enable semiconductor manufacturers to produce chips with smaller transistor linewidths.
NewsIntel is currently looking to sell a minority stake in its Programmable Solutions Group, Altera, with potential buyers such as Silver Lake and Bain Capital preparing to make a move, according to a Reuters report. Altera, a market leader in the FPGA space and the inventor of the world's first programmable logic device, was acquired by Intel for nearly $17 billion in 2015 with the expectation that it would help expand Intel's presence in the Internet of Things market.
NewsOn October 30, it was reported by the American Herald that New York-based silicon carbide material manufacturer Pallidus has terminated its relocation and new plant construction plans.
NewsAccording to recent reports from South Korean media, Samsung Electronics is preparing to introduce its first High NA EUV (Extreme Ultraviolet) lithography machine in early 2025, potentially marking a significant advancement for the company in advanced semiconductor manufacturing.
NewsRecently, several semiconductor giants, including ASE Group, TSMC, Tongfu Microelectronics, Huahong Technology, Yongxin Electronics, and JCET, have announced investments in advanced packaging technologies and capacity expansion, targeting high-performance memory and computing for AI applications. As the memory market recovers and demand for AI and high-performance computing grows in 2024, packaging companies are showing promising results.
NewsInfineon Launches World's Thinnest Silicon Power Wafer, Deliveries to First Customers Completed
NewsGuoke Test Secures Tens of Millions in Funding for Third-Generation Semiconductor Inspection Equipment
NewsSilicon Carbide Equipment Company Laplace Officially Listed!
NewsOver 10 Major Semiconductor Projects Bloom Across China!
News150% Increase from This Year! Intel Targets 100 Million AI PCs Shipped by 2025
NewsOn October 28, Intel, a leading semiconductor giant, announced a significant expansion of its Intel Chengdu Packaging and Testing Facility, adding $300 million to its registered capital at Intel Products (Chengdu) Co., Ltd. According to Chengdu authorities, Intel will extend its packaging and testing services from client products to server chips, setting up a new Customer Solutions Center. Planning and construction for these upgrades have already begun.