158 articles
NewsSamsung has reportedly made a breakthrough in its 3D NAND manufacturing process by significantly reducing the use of thick photoresist (PR), leading to substantial cost savings. This optimization underscores Samsung's commitment to innovation and operational efficiency in the highly competitive memory chip market.
NewsOn November 29, 2024, DENSO Corporation and Fuji Electric Co., Ltd. announced a joint investment of approximately ¥211.6 billion (around $1.4 billion) to enhance Japan's silicon carbide (SiC) power semiconductor production capacity. This initiative has received approval from Japan's Ministry of Economy, Trade and Industry (METI), which will provide up to ¥70.5 billion in subsidies to support the project.
NewsOn November 28, Shanghai Wanye Enterprise Co., Ltd. announced that 11 limited partners, including Hongtianyuan Management and Shenhongyuan Management, have transferred their entire stake in Hongtianyuan Partnership to Lead Technology and its subsidiary, Lead Hunter.
NewsOn November 26, 2024, Suzhou Xinrui Technology Co., Ltd. (Xinrui) and Shaoxin Laboratory officially signed a cooperation agreement to establish the "Wafer-Level Bonding Equipment and Materials Joint Laboratory." This milestone partnership marks the start of deep collaboration between the two entities, aiming to drive technological advancements and innovation in the semiconductor industry.
NewsShanghai is making significant strides in enhancing its computing infrastructure, focusing on expanding computing power capabilities, scaling intelligent computing deployment, and optimizing communication quality within computing networks.
NewsOn November 26, 2024, significant updates in silicon carbide (SiC) supply were announced by Chiplink Integrated Technology and ROHM Semiconductor, reflecting advancements in their respective collaborations with major automotive manufacturers.
NewsNova Technology (HK) Co., LTD, in collaboration with IC Online, is pleased to announce the successful conclusion of our participation in Electronica 2024, held in Munich from November 12 to 15, 2024. The event was a fantastic opportunity to connect with industry experts, clients, and partners, showcasing our latest PCBA solutions and electronic components at Hall C5, Booth 531.
NewsOn November 13, SK Hynix's NAND flash solution subsidiary, Solidigm, announced the launch of the world's largest capacity 122TB NAND flash solution based on QLC technology, the enterprise-level solid-state drive (eSSD) "D5-P5336".
NewsSilicon Carbide Equipment Company Laplace Officially Listed!
In recent years, wearable devices have seen explosive growth in various markets, especially in fitness tracking and medical monitoring, due to the convenience and real-time data feedback they offer. Devices like Samsung's Gear Fit 2, Qardio®Arm blood pressure monitor, and Under Armor's UA SpeedForm® Gemini 3 smart shoes provide users with vital health information such as sleep quality, activity levels, and walking or running pace.
Nova Technology (HK) Co Limited to Showcase at NEPCON Vietnam 2024
NewsAccording to a recent report from the Okinawa Institute of Science and Technology Graduate University (OIST) published on their website, a new extreme ultraviolet (EUV) lithography technology has been developed, surpassing the existing standards in semiconductor manufacturing. This innovative design enables the lithography equipment to utilize a smaller EUV light source, consuming less than one-tenth of the power of traditional EUV lithography machines. This advancement not only reduces costs but also significantly enhances the reliability and lifespan of the machines.