Coherent Expands World’s First 6-Inch Indium Phosphide (InP) Production Line
On December 9, Coherent announced plans to expand the world’s first 6-inch (150mm) InP wafer production line as part of a modernization project for its 700,000-square-foot advanced manufacturing cleanroom in Sherman, Texas. The initiative, supported by a $33 million investment under the U.S. CHIPS and Science Act, aims to scale InP device production and reinforce Coherent's position as a leader in the communications and sensing sectors.
On December 9, Coherent announced plans to expand the world’s first 6-inch (150mm) InP wafer production line as part of a modernization project for its 700,000-square-foot advanced manufacturing cleanroom in Sherman, Texas. The initiative, supported by a $33 million investment under the U.S. CHIPS and Science Act, aims to scale InP device production and reinforce Coherent's position as a leader in the communications and sensing sectors.
Key Expansion Details
Coherent established the world’s first 6-inch InP wafer manufacturing capacity in March 2023, with facilities in Sherman, Texas, and Järfälla, Sweden. The new investment will increase the deployment of advanced wafer manufacturing equipment, enabling substantial cost reductions—over 60%—while broadening applications in:
- Optical communications
- Data communication transceivers
- AI-powered smart connectivity
- Consumer electronics and wearables
- Advanced sensing for healthcare and automotive
- Emerging 6G wireless and satellite communication networks
Coherent projects that InP production will increasingly transition from 3-inch to 6-inch wafers in the coming years, leveraging the benefits of larger wafer sizes for higher yields, better performance, and reduced costs.
Other Developments in SiC and GaAs Technologies
Coherent is also making strides in Silicon Carbide (SiC) and Gallium Arsenide (GaAs) technologies:
SiC Innovations
- April 2024: Coherent received $15 million under the CHIPS Act to accelerate the commercialization of next-generation wide-bandgap (SiC) and ultra-wide-bandgap (single-crystal diamond) semiconductors.
- September 2024: Coherent introduced 8-inch SiC epitaxial wafers, offering 350-micron and 500-micron thick substrates, which are now shipping globally.
GaAs Operations
- September 2024: Coherent sold its Newton Aycliffe wafer fab in the UK to the British government for £20 million. This facility specializes in GaAs-based RF microelectronics and optoelectronics for communications and defense, including military applications such as fighter jet technologies.
- CEO Jim Anderson stated, “Divesting the Newton Aycliffe facility is part of our strategy to optimize operations and focus on areas of long-term growth and profitability.”
Strategic Implications
The expansion of Coherent’s 6-inch InP line and continued advancements in SiC and GaAs reflect its commitment to innovation and maintaining leadership in semiconductor materials. These developments align with growing market demand for high-performance solutions across industries such as telecommunications, AI, healthcare, and next-generation connectivity.
