Electronics Component News, Market Trends & Supply Chain Updates
NewsOn December 26, Jingcheng Technology announced its acquisition of 100% equity in Lincstech, a Japanese PCB (printed circuit board) manufacturing company, for 8.4 billion New Taiwan dollars.
NewsOn December 25, Hangzhou Silan Microelectronics Co., Ltd. (Silan Micro) announced that it had received a government subsidy of 18.37 million RMB on December 24, 2024. This subsidy accounts for 51.35% of the company's audited net profit attributable to shareholders for 2023.
NewsShanghai Herch Tech, a leading player in the semiconductor industry, recently held its 2024 half-year and third-quarter earnings conference. The company highlighted its efforts to navigate market challenges while accelerating technological advancements in the development of 12-inch N-type epitaxial wafers and new customer acquisition.
NewsOnsemi, a leading player in silicon carbide (SiC) technology, has recently made two significant acquisitions to strengthen its position in the power semiconductor market. The company has purchased a chip manufacturing facility in DeWitt, New York, and acquired SiC JFET technology along with Qorvo's subsidiary, United Silicon Carbide.
NewsDecember 24, 2024 – A groundbreaking diamond fabrication technology has been developed by a collaborative team from the University of Hong Kong’s Faculty of Engineering, Southern University of Science and Technology, and Peking University. The "edge-exposed peeling method" enables rapid and large-scale production of ultra-thin, flexible diamond films, marking a significant advancement in diamond manufacturing.
NewsIn a groundbreaking achievement, a collaborative research team from the University of Electronic Science and Technology of China (UESTC) and the Tianfu Jiangxi Laboratory, in partnership with Shandong University, has successfully developed the world's first light-atom entanglement chip based on erbium-doped lithium niobate crystal waveguides. This innovation represents a critical step forward in the development of long-distance, high-bandwidth quantum entanglement interconnection systems.
NewsSamsung Electronics has announced plans to establish a pilot line for its 10nm 7th-generation DRAM (1d DRAM) at its Pyeongtaek P2 facility. This initiative is aimed at strengthening the company's competitive edge and improving yield rates for its next-generation memory products.
NewsSamsung Electronics has officially secured a $4.745 billion subsidy from the U.S. government under the CHIPS and Science Act. This figure, recently confirmed by the U.S. Department of Commerce, is approximately 26% lower than the $6.4 billion initially outlined in the Preliminary Memorandum of Terms (PMT) signed in April 2023.
NewsIn a groundbreaking development for the semiconductor industry, Japan’s Rapidus has successfully begun installing its first ASML EUV lithography machine, becoming the country’s first semiconductor company to adopt this cutting-edge technology. This milestone positions Japan as a serious contender in the global race for advanced chip manufacturing.
NewsDecember 18, 2024 – Longsys Advanced's Wuhan Base marked a significant milestone as it welcomed the first batch of equipment into its facilities, signaling the start of its process validation phase. This major step brings the company closer to its goal of achieving full-scale production of silicon carbide (SiC) wafers by May 2025. The project is part of Longsys's strategy to strengthen its leadership in third-generation semiconductor manufacturing.
NewsOn December 12, Yicun Capital Co., Ltd., Wuxi Innovation Investment Group Co., Ltd., and Wuxi Liangxi Science and Technology City Innovation Investment Co., Ltd. announced the establishment of the Wuxi Bit Songling Artificial Intelligence Venture Capital Fund ("Bit Songling Fund"). The fund has completed its business registration, with an initial capital of 500 million RMB. It aims to support pioneering entrepreneurs in the field of artificial intelligence (AI) and foster a generation of top-tier AI companies.
NewsOn December 17, EEnews Europe reported that the Spanish government has secured approval from the European Commission to grant €81 million (approximately 613 million RMB) in subsidies to the Spanish subsidiary of Diamond Foundry, a US-based synthetic diamond manufacturer. This funding will support the construction of an $850 million (approximately 6.2 billion RMB) diamond wafer fabrication plant in Trujillo, Spain.