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MINI SOIC-8 EXP PAD STENCILRoHS / Compliance

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PA0170-S

MINI SOIC-8 EXP PAD STENCIL

Type
Mini SOIC
Pitch
0.026" (0.65mm)
Series
Proto-Advantage PA
Material
Stainless Steel
Datasheet (PDF)
RoHS Compliant

Why Choose Us

Quality Warranty
Quality guarantee
ESD Safe
Anti-static protection
Global Shipping
Fast delivery
Quick Response
Fast RFQ

Professional Packaging

Original Packaging

Factory sealed, ESD anti-static tray

Desiccant Protection

Humidity indicator card & silica gel included

Vacuum Sealing

Moisture barrier bag, nitrogen filled

Secure Boxing

Anti-vibration foam, shock-proof labeling

ParameterValue
CategorySolder Stencils, Templates
ManufacturerChip Quik Inc.
TypeMini SOIC
Pitch0.026" (0.65mm)
SeriesProto-Advantage PA
MaterialStainless Steel
PackagingBulk
Thickness0.0040" (0.102mm)
Part StatusActive
ManufacturerChip Quik Inc.
Inner Dimension0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad0.315" L x 0.067" W (8.00mm x 1.70mm)
Number of Positions8
Package
-
MSL
-

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