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TSSOP-16-EXP-PAD TO DIP-16 SMTIn StockRoHS / Compliance

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PA0193

TSSOP-16-EXP-PAD TO DIP-16 SMT

Pitch
0.026" (0.65mm)
Series
Proto-Advantage
Material
FR4 Epoxy Glass
Packaging
Bulk
Datasheet (PDF)
RoHS Compliant

Why Choose Us

Quality Warranty
Quality guarantee
ESD Safe
Anti-static protection
Global Shipping
Fast delivery
Quick Response
Fast RFQ

Professional Packaging

Original Packaging

Factory sealed, ESD anti-static tray

Desiccant Protection

Humidity indicator card & silica gel included

Vacuum Sealing

Moisture barrier bag, nitrogen filled

Secure Boxing

Anti-vibration foam, shock-proof labeling

ParameterValue
CategoryAdapter, Breakout Boards
ManufacturerChip Quik Inc.
Pitch0.026" (0.65mm)
SeriesProto-Advantage
MaterialFR4 Epoxy Glass
PackagingBulk
Part StatusActive
ManufacturerChip Quik Inc.
Board Thickness0.062" (1.57mm) 1/16"
Package AcceptedTSSOP
Proto Board TypeSMD to DIP
Size / Dimension0.700" x 0.800" (17.78mm x 20.32mm)
Number of Positions16
Package
-
MSL
-

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