Format
3FF (Micro)
Packaging
Bulk
Part Status
Active
Manufacturer
Hologram, Inc.
Why Choose Us
Quality Warranty
Quality guarantee
ESD Safe
Anti-static protection
Global Shipping
Fast delivery
Quick Response
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MOQ1 pcs
Professional Packaging
Original Packaging
Factory sealed, ESD anti-static tray
Desiccant Protection
Humidity indicator card & silica gel included
Vacuum Sealing
Moisture barrier bag, nitrogen filled
Secure Boxing
Anti-vibration foam, shock-proof labeling
| Parameter | Value |
|---|---|
| Category | Subscriber Identification Module (SIM) Cards |
| Manufacturer | Hologram, Inc. |
| Class | - |
| Format | 3FF (Micro) |
| Memory | - |
| Series | - |
| Features | - |
| Packaging | Bulk |
| Part Status | Active |
| Manufacturer | Hologram, Inc. |
| Core Processor | - |
| Carrier Network | - |
| Size / Dimension | 5mm L x 6mm W x 0.75mm H |
| Network Technology | 2G |
| Base Product Number | SIM-E-TRI |
| Operating Temperature | -25°C ~ 85°C |
Package
-
MSL
-