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GLOBAL IOT EMBEDDED SIM CHIPRoHS / Compliance

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SIM-ST-MFF2

GLOBAL IOT EMBEDDED SIM CHIP

Format
ESIM (MFF2)
Packaging
Tape & Reel (TR)
Part Status
Discontinued at Digi-Key
Manufacturer
Hologram, Inc.
Datasheet (PDF)
RoHS Compliant

Why Choose Us

Quality Warranty
Quality guarantee
ESD Safe
Anti-static protection
Global Shipping
Fast delivery
Quick Response
Fast RFQ

Professional Packaging

Original Packaging

Factory sealed, ESD anti-static tray

Desiccant Protection

Humidity indicator card & silica gel included

Vacuum Sealing

Moisture barrier bag, nitrogen filled

Secure Boxing

Anti-vibration foam, shock-proof labeling

ParameterValue
CategorySubscriber Identification Module (SIM) Cards
ManufacturerHologram, Inc.
Class-
FormatESIM (MFF2)
Memory-
Series-
Features-
PackagingTape & Reel (TR)
Part StatusDiscontinued at Digi-Key
ManufacturerHologram, Inc.
Core Processor-
Carrier Network-
Size / Dimension5mm L x 6mm W x 0.82mm H
Network Technology2G, 3G, 4G LTE IOT
Operating Temperature-
Package
-
MSL
-

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