IC Onlineerai
RFI FILM OVER FOAM PU SOLDERIn StockRoHS / Compliance

Images are for reference only

67SLG100100100PI00

RFI FILM OVER FOAM PU SOLDER

Type
Film Over Foam
Shape
Rectangle
Width
0.394" (10.00mm)
Height
0.394" (10.00mm)
Datasheet (PDF)
RoHS Compliant

Why Choose Us

Quality Warranty
Quality guarantee
ESD Safe
Anti-static protection
Global Shipping
Fast delivery
Quick Response
Fast RFQ

Professional Packaging

Original Packaging

Factory sealed, ESD anti-static tray

Desiccant Protection

Humidity indicator card & silica gel included

Vacuum Sealing

Moisture barrier bag, nitrogen filled

Secure Boxing

Anti-vibration foam, shock-proof labeling

ParameterValue
CategoryRFI and EMI - Contacts, Fingerstock and Gaskets
ManufacturerLaird Technologies EMI
TypeFilm Over Foam
ShapeRectangle
Width0.394" (10.00mm)
Height0.394" (10.00mm)
Length0.394" (10.00mm)
SeriesSMD Grounding Metallized
Plating-
MaterialPolyurethane Foam, Tin-Copper Polyester (SN/CU)
PackagingTape & Reel (TR) || Cut Tape (CT) || Digi-Reel®
Shelf Life24 Months
Part StatusActive
ManufacturerLaird Technologies EMI
Shelf Life StartDate of Shipment
Attachment MethodSolder
Plating - Thickness-
Operating Temperature-40°C ~ 70°C
Storage/Refrigeration Temperature-
Package
-
MSL
-

Related Products