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Intel Likely to Further Delay Restart of German Wafer Fab ConstructionNews

Intel Likely to Further Delay Restart of German Wafer Fab Construction

According to a recent report by Tom's Hardware, Intel has decided to extend the pause on its wafer fab construction plan in Magdeburg, Germany, with the restart now postponed until 2029 or 2030. If fully implemented, this measure will not only affect the development of Germany's semiconductor industry but also bring attention to the €10 billion in subsidies initially allocated to Intel, raising discussions on whether these funds should be reallocated.

China Achieves Breakthrough in 6-Inch AlN Single Crystal Composite Substrate and Wafer Manufacturing ProcessNews

China Achieves Breakthrough in 6-Inch AlN Single Crystal Composite Substrate and Wafer Manufacturing Process

Recently, the Songshan Lake Materials Laboratory's third-generation semiconductor team, in collaboration with Professor Jincheng Zhang and Professor Xiangdong Li from Academician Yue Hao's group at Xidian University, and Guangdong Zhien Technology Co., Ltd., successfully developed high-performance GaN HEMTs wafers based on 2-6 inch AlN single crystal composite substrates.

ROHM to Showcase Advanced Power and Analog Technologies at Electronica 2024News

ROHM to Showcase Advanced Power and Analog Technologies at Electronica 2024

Global semiconductor manufacturer ROHM (headquartered in Kyoto, Japan) will participate in the world-leading trade show for electronic components, systems, applications, and solutions—electronica 2024—which will be held from November 12 to 15 in Munich, Germany. ROHM's booth will be located at C3-520, where it will showcase its advanced power and analog technologies aimed at improving power density, efficiency, and reliability in automotive and industrial applications. These technologies are crucial for meeting the growing demands of modern electronic systems, particularly in the context of sustainability and innovation.

TSMC to Receive ASML's Cutting-Edge High NA EUV Lithography Machines, Advancing 2nm Process by Two GenerationsNews

TSMC to Receive ASML's Cutting-Edge High NA EUV Lithography Machines, Advancing 2nm Process by Two Generations

Taiwan Semiconductor Manufacturing Company (TSMC), the world's largest semiconductor manufacturer, is set to receive ASML's most advanced High NA Extreme Ultraviolet (EUV) lithography machines before the end of the year, according to Nikkei Asia. These cutting-edge machines, priced at over $350 million each, enable semiconductor manufacturers to produce chips with smaller transistor linewidths.

Intel's Altera: Potential $17B Minority Stake Sale Amidst Financial PressuresNews

Intel's Altera: Potential $17B Minority Stake Sale Amidst Financial Pressures

Intel is currently looking to sell a minority stake in its Programmable Solutions Group, Altera, with potential buyers such as Silver Lake and Bain Capital preparing to make a move, according to a Reuters report. Altera, a market leader in the FPGA space and the inventor of the world's first programmable logic device, was acquired by Intel for nearly $17 billion in 2015 with the expectation that it would help expand Intel's presence in the Internet of Things market.