Konka Ventures into Third-Generation Semiconductor Packaging and Testing

Recently, according to Yancheng News, an executive from Konka Xinyun Semiconductor Technology (Yancheng) Co., Ltd. (hereinafter referred to as "Konka Xinyun") stated that the company is promoting the research and development of third-generation semiconductor-related products and increasing investments to expand its product line.

Konka Xinyun, a subsidiary of Konka, primarily focuses on the storage sector. The total investment in its projects amounts to CNY 2 billion, covering an area of 100 acres, with a total construction area of 100,000 square meters and a floor area ratio of 1.46.

The project will be implemented in two phases, with the first phase involving an investment of CNY 1 billion, of which CNY 500 million is allocated for equipment, covering 50 acres for a new storage chip packaging and testing project.

Zhang Bo, Assistant General Manager of Konka Xinyun, commented, "Since the beginning of this year, we have strengthened industry-academia-research cooperation with universities to promote the development of third-generation semiconductor-related products. To further enhance our R&D capabilities, we have invested CNY 5 million to expand our product line."

Zhang Bo also added, "The company plans to fully achieve domestic substitution in materials and testing equipment to reduce reliance on external supply chains. Through continuous technological innovation and market expansion, we aim to build a product line with core competitiveness, actively advancing the research and application of third-generation semiconductor technology, providing safer and more reliable semiconductor solutions for customers, and contributing to independent innovation in the domestic semiconductor industry."