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Revolutionary Diamond Fabrication Technology Achieved by Chinese TeamNews

Revolutionary Diamond Fabrication Technology Achieved by Chinese Team

December 24, 2024 – A groundbreaking diamond fabrication technology has been developed by a collaborative team from the University of Hong Kong’s Faculty of Engineering, Southern University of Science and Technology, and Peking University. The "edge-exposed peeling method" enables rapid and large-scale production of ultra-thin, flexible diamond films, marking a significant advancement in diamond manufacturing.

Breakthrough: First Light-Atom Entanglement Chip Successfully DevelopedNews

Breakthrough: First Light-Atom Entanglement Chip Successfully Developed

In a groundbreaking achievement, a collaborative research team from the University of Electronic Science and Technology of China (UESTC) and the Tianfu Jiangxi Laboratory, in partnership with Shandong University, has successfully developed the world's first light-atom entanglement chip based on erbium-doped lithium niobate crystal waveguides. This innovation represents a critical step forward in the development of long-distance, high-bandwidth quantum entanglement interconnection systems.

Samsung Cuts Photoresist Usage by Half in 3D NAND ProductionNews

Samsung Cuts Photoresist Usage by Half in 3D NAND Production

Samsung has reportedly made a breakthrough in its 3D NAND manufacturing process by significantly reducing the use of thick photoresist (PR), leading to substantial cost savings. This optimization underscores Samsung's commitment to innovation and operational efficiency in the highly competitive memory chip market.

DENSO and Fuji Electric Announce $1.4 Billion Joint SiC Semiconductor ProjectNews

DENSO and Fuji Electric Announce $1.4 Billion Joint SiC Semiconductor Project

On November 29, 2024, DENSO Corporation and Fuji Electric Co., Ltd. announced a joint investment of approximately ¥211.6 billion (around $1.4 billion) to enhance Japan's silicon carbide (SiC) power semiconductor production capacity. This initiative has received approval from Japan's Ministry of Economy, Trade and Industry (METI), which will provide up to ¥70.5 billion in subsidies to support the project.