The IC-Online Electronics Blog

Electronics Component News, Market Trends & Supply Chain Updates

Former Wolfspeed Executive Joins China's Qingchun Semiconductor as CMONews

Former Wolfspeed Executive Joins China's Qingchun Semiconductor as CMO

March 12, 2025 – Qingchun Semiconductor, a rising player in the silicon carbide (SiC) power semiconductor industry, has announced the appointment of Robin Zhang (张三岭) as its Chief Marketing Officer (CMO). Zhang, a seasoned industry expert with over 20 years of experience in analog and power semiconductors, will now oversee the company’s global sales and marketing strategy.

MediaTek and TSMC Successfully Develop Industry's First N6RF+ Silicon-Proven PMU & iPANews

MediaTek and TSMC Successfully Develop Industry's First N6RF+ Silicon-Proven PMU & iPA

March 12, 2025 – MediaTek and TSMC (Taiwan Semiconductor Manufacturing Company) have announced a groundbreaking achievement: the successful development of the industry’s first N6RF+ silicon-proven Power Management Unit (PMU) and Integrated Power Amplifier (iPA). This collaboration leverages TSMC's cutting-edge N6RF+ process to integrate these essential wireless communication components into a single System-on-Chip (SoC), reducing footprint while maintaining performance comparable to discrete modules.

G.SKILL Unveils High-Performance Overclocking DDR5 Memory KitsNews

G.SKILL Unveils High-Performance Overclocking DDR5 Memory Kits

March 12, 2025 – Renowned overclocking memory and gaming hardware brand G.SKILL has officially launched a series of high-performance DDR5 memory kits, including DDR5-8000 CL36-48-48 48GB (24GBx2), DDR5-6000 CL28-36-36 192GB (48GBx4), and DDR5-6000 CL26-39-39 48GB (24GBx2). These latest memory kits will be available under G.SKILL’s Trident Z5 Royal EXPO, Ripjaws RGB, and Flare X5 RGB series, fully supporting AMD EXPO memory overclocking technology. Designed for high-end gamers, content creators, and professionals handling AI model training, machine learning, deep learning, and data-intensive computing, these memory kits offer outstanding speed, efficiency, and stability.

Intel’s New Strategy: Maintaining 30% Outsourced Wafer Production with TSMC as a Key PartnerNews

Intel’s New Strategy: Maintaining 30% Outsourced Wafer Production with TSMC as a Key Partner

March 12, 2025 – Intel has reaffirmed its commitment to outsourcing approximately 30% of its wafer production, with TSMC serving as a key external supplier. This strategic move, outlined by Intel's Vice President of Investor Relations, John Pitzer, during the Morgan Stanley Technology Conference, highlights Intel's long-term partnership with TSMC and its evolving manufacturing approach.

Western Digital Exits SSD Market, Transfers NAND Business to SanDiskNews

Western Digital Exits SSD Market, Transfers NAND Business to SanDisk

Western Digital (WD) has officially completed the full separation of its NAND Flash business, transferring all related operations to its wholly-owned subsidiary, SanDisk. This strategic move signifies a major shift for Western Digital, which will exit the SSD market entirely and focus solely on mechanical hard drives (HDDs) moving forward.