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Electronics Component News, Market Trends & Supply Chain Updates

Seagate Unveils Exos M 36TB HDD Featuring HAMR TechnologyNews

Seagate Unveils Exos M 36TB HDD Featuring HAMR Technology

Seagate continues to push the boundaries of high-capacity storage with the launch of the Exos M 36TB HDD, marking another milestone in data center storage technology. This latest drive, based on Heat-Assisted Magnetic Recording (HAMR) technology, delivers unprecedented storage density, making it the highest-capacity HDD available today.

Samsung Electronics Enhances Semiconductor Memory DesignNews

Samsung Electronics Enhances Semiconductor Memory Design

Samsung Electronics is making significant improvements to its 12nm-class DRAM (D1b), marking a rare move in the semiconductor industry. According to recent reports from the South Korean semiconductor sector, the company has initiated design modifications to D1b DRAM, which was first mass-produced in 2023 for graphics DRAM and mobile DRAM applications.

Pat Gelsinger Joins UK AI Chip Startup Fractile.ai as Seed InvestorNews

Pat Gelsinger Joins UK AI Chip Startup Fractile.ai as Seed Investor

Former Intel CEO Pat Gelsinger has revealed his latest venture after stepping down from the semiconductor giant. In a recent announcement on social media platform X, Gelsinger disclosed that he has become a seed investor in Fractile.ai, a UK-based artificial intelligence (AI) chip startup, signaling his ongoing interest in the rapidly evolving AI chip market.

UMC Addresses Earthquake Impact on OperationsNews

UMC Addresses Earthquake Impact on Operations

On January 21, a 6.4-magnitude earthquake struck Taiwan's Chiayi region, with tremors affecting semiconductor giants TSMC and UMC's fabs in Tainan. Due to the seismic intensity exceeding level 4 in certain areas, both companies implemented immediate safety protocols, including personnel evacuation and equipment inspections. While no major equipment damage was reported, unavoidable wafer breakage occurred within furnace tube equipment.

Samsung Foundry to Cut Capital Expenditure for 2025 Amid Market SlumpNews

Samsung Foundry to Cut Capital Expenditure for 2025 Amid Market Slump

Samsung Electronics has announced a significant reduction in its 2025 capital expenditure (CapEx) for its foundry business due to weak market demand and sluggish orders in some segments. According to Korean media reports, Samsung's foundry CapEx for 2025 is projected at KRW 5 trillion, a sharp decline from the KRW 10 trillion allocated in 2024.

SK Hynix Reports Record High Financial Results for FY2024 and Q4, Driven by AI-Driven Memory DemandNews

SK Hynix Reports Record High Financial Results for FY2024 and Q4, Driven by AI-Driven Memory Demand

Record-Breaking Performance On January 23, 2025, SK Hynix reported its financial results for FY2024, ending December 31, 2024. The company achieved record annual revenue of KRW 66.193 trillion, up over KRW 21 trillion from its previous high in 2022, and an operating profit of KRW 23.467 trillion with a robust operating profit margin of 35%. Net profit reached KRW 19.797 trillion, with a net profit margin of 30%.

Silicon Motion Developing PCIe 6.0 SSD Controller SM8466 on Advanced 4nm ProcessNews

Silicon Motion Developing PCIe 6.0 SSD Controller SM8466 on Advanced 4nm Process

Silicon Motion (SMI) is reportedly developing its next-generation PCIe 6.0 solid-state drive (SSD) controller, the SM8466, utilizing advanced 4nm semiconductor process technology.Building on its legacy with the SM8266 and SM8366 controllers for PCIe 4.0 and PCIe 5.0 enterprise-grade SSDs, the SM8466 is expected to target enterprise applications. This controller will support PCIe 6.0 x4 lanes, delivering a theoretical bandwidth of up to 30.25 GB/s—doubling the data transfer rate compared to PCIe 5.0-based SSDs.