IC Onlineerai

150% Increase from This Year! Intel Targets 100 Million AI PCs Shipped by 2025

150% Increase from This Year! Intel Targets 100 Million AI PCs Shipped by 2025

According to South Korean media outlet The Elec, Intel has set a target of shipping 100 million AI PCs next year, marking a 150% increase from its 2024 goal of 40 million units.

Jack Huang, Intel's Director of Sales and Marketing Group, shared during a press conference in Korea on October 28 that most PCs shipped next year will feature Meteor Lake, introduced late last year, with shipments reaching 20 million units this year.

Huang noted that the 100 million target includes both laptops and notebooks, with the latter accounting for 80-85%. In addition to Meteor Lake, these PCs will also be equipped with Lunar Lake and Arrow Lake-S.

Lunar Lake and Arrow Lake-S were launched in Korea last week, with the code names Intel Core Ultra 200V (for laptops) and Intel Core Ultra 200S (for desktops), respectively. Huang highlighted that the NPU performance of the Ultra 200V is four times that of the previous generation, while the Ultra 200S offers excellent gaming performance and efficiency.

Related Articles

  • Cisco Unveils Quantum Networking Chip and Launches New Quantum Lab in CaliforniaNews

    Cisco Unveils Quantum Networking Chip and Launches New Quantum Lab in California

    May 8, 2025 – California, USA — Cisco Systems has taken a bold step into the future of computing by unveiling a prototype quantum networking chip designed to interconnect quantum computers. At the same time, the company announced the establishment of a brand-new quantum computing research lab in Santa Monica, California, marking a major expansion into the quantum technology landscape.

  • UK Launches Europe’s First and the World’s Second Electron Beam Lithography FacilityNews

    UK Launches Europe’s First and the World’s Second Electron Beam Lithography Facility

    May 8, 2025 — In a major technological leap for Europe’s semiconductor industry, the University of Southampton in the United Kingdom has officially launched the continent’s first advanced semiconductor fabrication facility powered by electron beam lithography (EBL). The site now houses the world’s second EBL machine of its kind, marking a key milestone in next-generation chipmaking.

  • Huawei’s Hubble Invests in Two Strategic Tech Firms to Strengthen Robotics and Simulation CapabilitiesNews

    Huawei’s Hubble Invests in Two Strategic Tech Firms to Strengthen Robotics and Simulation Capabilities

    Huawei’s investment arm, Hubble Technology Investment, has made two new strategic moves in May 2025, expanding its presence in cutting-edge technology domains. The company has invested in Qianxun Intelligent, a startup focused on embodied AI and humanoid robotics, and Tongyuan SoftControl, a leader in cyber-physical system simulation software. These investments underscore Huawei’s continued commitment to building a robust technological ecosystem across AI, robotics, and advanced industrial software.

  • Samsung’s Harman Acquires Masimo’s Audio Division for $350 Million to Strengthen Automotive Tech FootprintNews

    Samsung’s Harman Acquires Masimo’s Audio Division for $350 Million to Strengthen Automotive Tech Footprint

    May 9, 2025 — Samsung Electronics’ subsidiary Harman International has announced a strategic acquisition of the audio division of U.S.-based Masimo Corporation for $350 million, further cementing its position in the global automotive and consumer electronics markets. The deal marks a significant move in Samsung's ongoing expansion strategy and has sparked speculation around more tech-focused acquisitions in the near future.

  • GlobalWafers to Launch First U.S. 12-Inch Silicon Wafer Fab on May 15News

    GlobalWafers to Launch First U.S. 12-Inch Silicon Wafer Fab on May 15

    May 13, 2025 — GlobalWafers, the world’s third-largest semiconductor wafer supplier, is set to officially open its new state-of-the-art facility in Texas on May 15, marking a historic milestone as the first 12-inch silicon wafer production plant in the United States. The new factory is expected to begin contributing to the company’s revenue in the second half of 2025.

  • NEO Semiconductor Unveils Next-Gen 3D X-DRAM Aiming to Boost DRAM Density by 10xNews

    NEO Semiconductor Unveils Next-Gen 3D X-DRAM Aiming to Boost DRAM Density by 10x

    May 9, 2025 — U.S.-based memory innovator NEO Semiconductor has announced a major leap in dynamic random-access memory (DRAM) architecture with the launch of its new-generation 3D X-DRAM technology, featuring the industry’s first 1T1C and 3T0C 3D DRAM cell designs. This breakthrough is set to redefine memory performance and scalability for high-demand applications in AI, edge computing, and in-memory processing.