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Arctic Core Secures Investment from Xi'an Caijin and WOG Optoelectronics to Accelerate Chiplet Product Library Development

Arctic Core has announced a new round of investment from Xi'an Caijin and WOG Optoelectronics. The funds will be primarily allocated to the design, R&D, and testing of next-generation functional Chiplet products, further advancing the construction of the company’s Chiplet product library centered around its Qiming 935 general-purpose HUB Chiplet.

Arctic Core has announced a new round of investment from Xi'an Caijin and WOG Optoelectronics. The funds will be primarily allocated to the design, R&D, and testing of next-generation functional Chiplet products, further advancing the construction of the company’s Chiplet product library centered around its Qiming 935 general-purpose HUB Chiplet.

Leading Innovation in Chiplet-Based High-Performance Computing

Arctic Core, originating from Tsinghua University’s Institute for Interdisciplinary Information Sciences, aims to become a pioneer in Chiplet-based high-performance computing solutions. The company’s core team has been at the forefront of the Chiplet field for years.

  • 2023 Milestones: Arctic Core launched China’s first Chiplet architecture-based chip, the Qiming 930, successfully verifying processes on the domestic packaging supply chain.

  • The company also introduced D2D interface PB Link, based on China’s High-Speed Chiplet Interconnect Standard, laying the foundation for independent Chiplet development and large-scale production.

  • 2024 Breakthroughs: Arctic Core developed the Zeus NPU module, which natively supports Transformer operators across multiple precision levels (INT4, INT8, INT16, FP16). This module supports mainstream AI frameworks and targets edge and endpoint AI inference applications, including autonomous driving and embodied intelligence systems.

Qiming 935 and AI Chiplet: Pioneering in Automotive Chiplets

Arctic Core’s flagship Qiming 935 general-purpose HUB Chiplet and the Big Bear Constellation AI Chiplet have already undergone successful tape-out. Multi-core autonomous driving chips based on these Chiplets achieved the ISO-26262 ASIL-B automotive safety certification from SGS-TUV and China Automotive Technology & Research Center (CATARC) in 2024. Notably, Arctic Core’s product became the first domestically certified automotive-grade Chiplet.

Accelerating Development of the Chiplet Product Library

Arctic Core continues to strengthen its first-mover advantage by building the first independently marketable Chiplet product library in China. With the continuous rollout of diverse Chiplets, Arctic Core will remain agile, focusing on:

  • Developing various functional Chiplets
  • Innovating Chiplet interconnect interfaces compatible with different manufacturing processes

This strategy aligns with the company's “small-step, fast-iteration” approach, ensuring rapid response to market demands and driving forward the evolution of the domestic Chiplet ecosystem.

Industry Impact

Arctic Core’s advancements, particularly in AI Chiplets and automotive-grade Chiplet products, position the company at the forefront of China’s high-performance computing and autonomous driving markets. By bridging advanced heterogeneous integration and standardized interfaces, Arctic Core is paving the way for scalable, cost-effective, and high-efficiency Chiplet solutions in the AI and automotive industries.

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