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ASML and Imec Expand Strategic Partnership to Advance Semiconductor Innovation

ASML, the world’s leading semiconductor equipment manufacturer, has announced a new five-year strategic partnership with Imec, Belgium’s premier microelectronics research center. This collaboration aims to drive cutting-edge innovations in semiconductor manufacturing, focusing on next-generation lithography, memory solutions, and advanced packaging technologies.

Five-year collaboration focuses on next-generation semiconductor technologies

Key areas include high-NA EUV, silicon photonics, memory, and advanced packaging

ASML's latest lithography systems to be integrated into research projects

ASML, the world’s leading semiconductor equipment manufacturer, has announced a new five-year strategic partnership with Imec, Belgium’s premier microelectronics research center. This collaboration aims to drive cutting-edge innovations in semiconductor manufacturing, focusing on next-generation lithography, memory solutions, and advanced packaging technologies.

Expanding ASML-Imec Collaboration

This agreement builds on the long-standing partnership between ASML and Imec. Their latest collaboration will integrate ASML’s full product portfolio, including:

  • High-NA EUV lithography (0.55 NA) – Enabling smaller, faster, and more efficient chips
  • Standard EUV lithography (0.33 NA) – Enhancing extreme ultraviolet manufacturing
  • DUV immersion lithography – Supporting mature and cost-effective semiconductor nodes
  • YieldStar optical metrology and HMI multi-beam technology – Improving precision and defect detection

Key Focus Areas: Memory, Silicon Photonics, and Advanced Packaging

The new partnership aims to develop next-generation semiconductor solutions in key areas:

  • Memory Innovation – Improving DRAM, NAND, and emerging storage solutions for AI and high-performance computing (HPC).
  • Silicon Photonics – Enhancing data transmission speeds for next-gen computing and networking applications.
  • Advanced Packaging – Developing innovative chiplet integration and 3D stacking technologies to optimize performance and power efficiency.

ASML’s Commitment to High-NA EUV

ASML and Imec previously announced plans to establish a dedicated High-NA EUV lithography lab in Veldhoven, Netherlands. High-NA EUV, a breakthrough in extreme ultraviolet (EUV) lithography, is expected to increase resolution by 60% compared to earlier EUV generations, enabling the production of smaller, faster, and more efficient chips.

ASML anticipates that customers will begin using High-NA EUV technology for commercial chip production by 2025-2026, marking a major milestone in semiconductor fabrication.

Shaping the Future of Semiconductor Manufacturing

By combining ASML’s industry-leading lithography expertise with Imec’s cutting-edge semiconductor research, this partnership will accelerate the development of scalable, sustainable, and high-performance semiconductor solutions.

As AI, 5G, and quantum computing drive demand for more powerful and energy-efficient chips, ASML and Imec’s collaborative innovations will play a critical role in shaping the future of the global semiconductor industry.

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