IC Onlineerai

China Accelerates Development of Automotive Chip Industry Standards with Target of 70 Key Standards

According to CCTV News, China is accelerating the development of industry standards for automotive chips. The Ministry of Industry and Information Technology (MIIT) released the "National Automotive Chip Standard System Construction Guide" in January of this year, proposing that by 2025, over 30 key standards for automotive chips will be developed, and by 2030, over 70 related standards will be established, covering typical automotive chip application scenarios and testing methods.

According to CCTV News, China is accelerating the development of industry standards for automotive chips. The Ministry of Industry and Information Technology (MIIT) released the "National Automotive Chip Standard System Construction Guide" in January of this year, proposing that by 2025, over 30 key standards for automotive chips will be developed, and by 2030, over 70 related standards will be established, covering typical automotive chip application scenarios and testing methods.

The "Guide" emphasizes accelerating the development of key standards for automotive chip environment and reliability, electric vehicle chip environment and reliability, and automotive chip information security. In addition, the guide aims to promote the development of important standards for intelligent driving computing chips, automotive ETC chips, infrared thermal imaging chips, cellular communication chips, security chips, and power drive chips for electric vehicles, further refining the technical requirements and testing methods for various automotive chips.

Recently, China's new energy vehicle production exceeded 10 million units annually for the first time, driving the rapid increase in market demand for automotive chips. At the same time, core technological breakthroughs in automotive chips have become a focal point for the industry. Recently, China's first national-level automotive chip testing center was established in Shanghai.

The National Automotive Chip Quality Inspection Center, initiated by Shanghai Motor Vehicle Inspection and Certification Technology Research Center Co., Ltd., will focus on the development needs of the industry, integrate advantageous resources, and address a range of foundational, public, and industry-specific inspection and testing technical bottlenecks. It will enhance research into key core technologies related to automotive chip performance, reliability, automotive-grade suitability, and real-world operating conditions. The center aims to develop board-level, system-level, and vehicle-level in-loop testing capabilities, providing automotive chip companies with full industry chain and full lifecycle testing services.

According to the Shanghai Municipal Market Supervision Administration, the construction period for the National Automotive Chip Quality Inspection Center is set at 18 months. The center plans to establish six specialized laboratories focused on integrated circuits, third-generation semiconductors, automotive-specific sensor chips, multi-chip modules, automotive passive components, and chip failure analysis. It will focus on standard research and experimental validation for four types of chips: control chips, power chips, memory chips, and high-performance computing chips, while addressing full-link testing requirements for automotive chips in design and development, R&D testing, vehicle verification, production quality control, and risk assessment. Based on these foundations, it will improve fault and failure analysis capabilities, establish a quality assurance system for the industry chain, and enhance the quality supply and market competitiveness of automotive chips in China.

Related Articles

  • TSMC Breaks Ground on Third Arizona Fab, Escalating Advanced Chip Manufacturing in the U.S.News

    TSMC Breaks Ground on Third Arizona Fab, Escalating Advanced Chip Manufacturing in the U.S.

    TSMC Arizona has officially begun construction on its third semiconductor fabrication facility in Phoenix, signaling the company’s deepening commitment to building a comprehensive and cutting-edge chip manufacturing hub in the United States. This third fab will sit adjacent to TSMC’s first two facilities, which are scheduled to begin production in 2025 and 2026 with 4nm and 3nm process technologies, respectively.

  • UK Launches Europe’s First and the World’s Second Electron Beam Lithography FacilityNews

    UK Launches Europe’s First and the World’s Second Electron Beam Lithography Facility

    May 8, 2025 — In a major technological leap for Europe’s semiconductor industry, the University of Southampton in the United Kingdom has officially launched the continent’s first advanced semiconductor fabrication facility powered by electron beam lithography (EBL). The site now houses the world’s second EBL machine of its kind, marking a key milestone in next-generation chipmaking.

  • Huawei’s Hubble Invests in Two Strategic Tech Firms to Strengthen Robotics and Simulation CapabilitiesNews

    Huawei’s Hubble Invests in Two Strategic Tech Firms to Strengthen Robotics and Simulation Capabilities

    Huawei’s investment arm, Hubble Technology Investment, has made two new strategic moves in May 2025, expanding its presence in cutting-edge technology domains. The company has invested in Qianxun Intelligent, a startup focused on embodied AI and humanoid robotics, and Tongyuan SoftControl, a leader in cyber-physical system simulation software. These investments underscore Huawei’s continued commitment to building a robust technological ecosystem across AI, robotics, and advanced industrial software.

  • Cisco Unveils Quantum Networking Chip and Launches New Quantum Lab in CaliforniaNews

    Cisco Unveils Quantum Networking Chip and Launches New Quantum Lab in California

    May 8, 2025 – California, USA — Cisco Systems has taken a bold step into the future of computing by unveiling a prototype quantum networking chip designed to interconnect quantum computers. At the same time, the company announced the establishment of a brand-new quantum computing research lab in Santa Monica, California, marking a major expansion into the quantum technology landscape.

  • GlobalWafers to Launch First U.S. 12-Inch Silicon Wafer Fab on May 15News

    GlobalWafers to Launch First U.S. 12-Inch Silicon Wafer Fab on May 15

    May 13, 2025 — GlobalWafers, the world’s third-largest semiconductor wafer supplier, is set to officially open its new state-of-the-art facility in Texas on May 15, marking a historic milestone as the first 12-inch silicon wafer production plant in the United States. The new factory is expected to begin contributing to the company’s revenue in the second half of 2025.