IC Onlineerai

DATA Launches LEGEND 860 Mid-Range PCIe 4.0 SSD

ADATA has announced the release of the LEGEND 860 M.2 Gen 4 NVMe SSD, a new M.2 2280 form factor product that uses the PCIe 4.0 x4 interface and is available in 500GB, 1TB, and 2TB capacities. ADATA claims that the new product is three times faster than standard PCIe 3.0 SSDs and ten times faster than SATA SSDs, targeting mid-range users seeking fast and reliable storage solutions for PCs, laptops, or PlayStation 5 devices.

ADATA has announced the release of the LEGEND 860 M.2 Gen 4 NVMe SSD, a new M.2 2280 form factor product that uses the PCIe 4.0 x4 interface and is available in 500GB, 1TB, and 2TB capacities. ADATA claims that the new product is three times faster than standard PCIe 3.0 SSDs and ten times faster than SATA SSDs, targeting mid-range users seeking fast and reliable storage solutions for PCs, laptops, or PlayStation 5 devices.

The LEGEND 860 M.2 Gen 4 NVMe SSD is made of carefully selected high-quality components, featuring 3D NAND flash memory. It supports SLC Cache, Host Memory Buffer (HMB) technology, and Low-Density Parity Check (LDPC) error correction, providing advantages in system loading and data caching while ensuring data transfer accuracy and file safety. It offers maximum sequential read speeds of up to 6000MB/s for PCs and laptops and 5000MB/s for PlayStation 5, with a maximum sequential write speed of 5000MB/s, allowing for smoother multitasking. The Total Bytes Written (TBW) ratings for the 500GB, 1TB, and 2TB versions are 160TB, 320TB, and 640TB, respectively.

The LEGEND 860 M.2 Gen 4 NVMe SSD is equipped with a thin aluminum heatsink to enhance heat dissipation efficiency, providing users with a smooth and lag-free gaming experience. Additionally, users can use the SSD Toolbox software to check the health status of the SSD, monitor its status in real-time, and update to the latest firmware for optimal performance.

ADATA offers a five-year limited warranty for the LEGEND 860 M.2 Gen 4 NVMe SSD, but the price has not yet been announced.

Related Articles

  • Qualcomm Snapdragon 8 Elite Gen 2 to Debut in September with TSMC N3P Node and Major Performance BoostNews

    Qualcomm Snapdragon 8 Elite Gen 2 to Debut in September with TSMC N3P Node and Major Performance Boost

    Qualcomm is expected to unveil its next-generation flagship mobile chipset — the Snapdragon 8 Elite Gen 2 — during its Snapdragon Tech Summit, which has been rescheduled earlier this year for September 2025. Ahead of the official launch, key details about the chipset’s architecture and performance enhancements have surfaced, setting the stage for a major leap in mobile computing power.

  • NEO Semiconductor Unveils Next-Gen 3D X-DRAM Aiming to Boost DRAM Density by 10xNews

    NEO Semiconductor Unveils Next-Gen 3D X-DRAM Aiming to Boost DRAM Density by 10x

    May 9, 2025 — U.S.-based memory innovator NEO Semiconductor has announced a major leap in dynamic random-access memory (DRAM) architecture with the launch of its new-generation 3D X-DRAM technology, featuring the industry’s first 1T1C and 3T0C 3D DRAM cell designs. This breakthrough is set to redefine memory performance and scalability for high-demand applications in AI, edge computing, and in-memory processing.

  • Cisco Unveils Quantum Networking Chip and Launches New Quantum Lab in CaliforniaNews

    Cisco Unveils Quantum Networking Chip and Launches New Quantum Lab in California

    May 8, 2025 – California, USA — Cisco Systems has taken a bold step into the future of computing by unveiling a prototype quantum networking chip designed to interconnect quantum computers. At the same time, the company announced the establishment of a brand-new quantum computing research lab in Santa Monica, California, marking a major expansion into the quantum technology landscape.

  • EU Launches "Chips Act 2.0" to Revitalize Semiconductor Ambitions Amid 2030 Goal DoubtsNews

    EU Launches "Chips Act 2.0" to Revitalize Semiconductor Ambitions Amid 2030 Goal Doubts

    The European Union is preparing a strategic upgrade to its semiconductor policy through the introduction of the “EU Chips Act 2.0”, aiming to address mounting concerns over the bloc's ability to meet its 2030 chip production targets. The original Chips Act, which came into effect in 2023, set the ambitious goal of doubling Europe’s share of global semiconductor production to 20%. However, industry insiders and auditors now warn that this target is unlikely to be reached without major structural changes.

  • TSMC Breaks Ground on Third Arizona Fab, Escalating Advanced Chip Manufacturing in the U.S.News

    TSMC Breaks Ground on Third Arizona Fab, Escalating Advanced Chip Manufacturing in the U.S.

    TSMC Arizona has officially begun construction on its third semiconductor fabrication facility in Phoenix, signaling the company’s deepening commitment to building a comprehensive and cutting-edge chip manufacturing hub in the United States. This third fab will sit adjacent to TSMC’s first two facilities, which are scheduled to begin production in 2025 and 2026 with 4nm and 3nm process technologies, respectively.

  • GlobalWafers to Launch First U.S. 12-Inch Silicon Wafer Fab on May 15News

    GlobalWafers to Launch First U.S. 12-Inch Silicon Wafer Fab on May 15

    May 13, 2025 — GlobalWafers, the world’s third-largest semiconductor wafer supplier, is set to officially open its new state-of-the-art facility in Texas on May 15, marking a historic milestone as the first 12-inch silicon wafer production plant in the United States. The new factory is expected to begin contributing to the company’s revenue in the second half of 2025.