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NewsNEO Semiconductor Unveils Next-Gen 3D X-DRAM Aiming to Boost DRAM Density by 10x
May 9, 2025 — U.S.-based memory innovator NEO Semiconductor has announced a major leap in dynamic random-access memory (DRAM) architecture with the launch of its new-generation 3D X-DRAM technology, featuring the industry’s first 1T1C and 3T0C 3D DRAM cell designs. This breakthrough is set to redefine memory performance and scalability for high-demand applications in AI, edge computing, and in-memory processing.
NewsHuawei’s Hubble Invests in Two Strategic Tech Firms to Strengthen Robotics and Simulation Capabilities
Huawei’s investment arm, Hubble Technology Investment, has made two new strategic moves in May 2025, expanding its presence in cutting-edge technology domains. The company has invested in Qianxun Intelligent, a startup focused on embodied AI and humanoid robotics, and Tongyuan SoftControl, a leader in cyber-physical system simulation software. These investments underscore Huawei’s continued commitment to building a robust technological ecosystem across AI, robotics, and advanced industrial software.
NewsUK Launches Europe’s First and the World’s Second Electron Beam Lithography Facility
May 8, 2025 — In a major technological leap for Europe’s semiconductor industry, the University of Southampton in the United Kingdom has officially launched the continent’s first advanced semiconductor fabrication facility powered by electron beam lithography (EBL). The site now houses the world’s second EBL machine of its kind, marking a key milestone in next-generation chipmaking.
NewsQualcomm Snapdragon 8 Elite Gen 2 to Debut in September with TSMC N3P Node and Major Performance Boost
Qualcomm is expected to unveil its next-generation flagship mobile chipset — the Snapdragon 8 Elite Gen 2 — during its Snapdragon Tech Summit, which has been rescheduled earlier this year for September 2025. Ahead of the official launch, key details about the chipset’s architecture and performance enhancements have surfaced, setting the stage for a major leap in mobile computing power.
NewsGlobalWafers to Launch First U.S. 12-Inch Silicon Wafer Fab on May 15
May 13, 2025 — GlobalWafers, the world’s third-largest semiconductor wafer supplier, is set to officially open its new state-of-the-art facility in Texas on May 15, marking a historic milestone as the first 12-inch silicon wafer production plant in the United States. The new factory is expected to begin contributing to the company’s revenue in the second half of 2025.
NewsPSMC Unveils 3D AI Semiconductor Solutions with Key Partners at COMPUTEX 2025
May 13, 2025 — Taiwanese foundry Powerchip Semiconductor Manufacturing Corp. (PSMC) announced that it will showcase a comprehensive suite of 3D AI semiconductor solutions at COMPUTEX Taipei 2025, partnering with key supply chain collaborators including Etron Technology, Winbond, ITRI, Ardentec, Skymizer, Mantex, Zentel, and Powerchip Microelectronics.